Semiconductor Strip Cutting Layout Without Extra Storage Units
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Solution Overview
Problem
Existing semiconductor package cutting systems require additional storage units for partial-cut semiconductor strips, increasing costs and equipment footprint.
Innovation Solution
A semiconductor package cutting system that integrates a cutting device, an inspection device, and a storage device, allowing for self-loading and unloading of materials without an additional storage unit, enabling partial-cutting of semiconductor packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an additional storage unit is used to store partial-cut semiconductor strips, then the partial-cutting process can be performed, but the cost and footprint of the equipment are increased
Solution Approach 1:
The patent combines the storage function with the existing inspection device by integrating a storage tray into the inspection device's structure. This merging eliminates the need for a separate additional storage unit, thereby reducing equipment footprint while maintaining partial-cutting capability. The storage tray is positioned to receive partial-cut semiconductor strips directly from the cutting device and transfer them to the dicing device, integrating multiple functions into a unified system.
2Adaptability or versatility
If an additional storage unit is used to store partial-cut semiconductor strips, then the partial-cutting process can be performed, but the cost of the process is increased
Solution Approach 1:
The patent merges the storage function with the inspection device, eliminating the need for a separate storage unit and reducing overall equipment cost. By integrating the storage tray into the existing inspection device structure, the system avoids additional manufacturing costs while enabling partial-cutting functionality.
Solution Approach 2:
The inspection device is given multiple functions: it not only inspects semiconductor strips but also stores partial-cut strips via the integrated storage tray. This multi-functionality reduces the need for separate dedicated storage equipment, thereby lowering process costs while maintaining full partial-cutting capability.
3Area of stationary object
If the inspection device is used for both inspection and storage, then additional storage units are eliminated, but the inspection device must handle multiple functions
Solution Approach 1:
The patent combines storage and inspection functions within the same device by integrating a storage tray into the inspection device. This merging eliminates the need for separate storage equipment, reducing overall system complexity despite the inspection device handling multiple functions. The integrated design streamlines material flow between cutting, inspection, and dicing operations.
Data Source
AI summary
Provided is a semiconductor package cutting system including a cutting device for partial-cutting at least a portion of a strip including a plurality of semiconductor packages, an inspection device mounted at a side of the cutting device to supply a first strip to be cut to the cutting device and to receive and inspect a second strip cut by the cutting device, and a storage device mounted at a side of the inspection device to supply the first strip stored therein, to the inspection device and to receive and store the second strip inspected by the inspection device, wherein the inspection device includes an inspection table for placing the second strip thereon and moving the second strip along a first direction.