Semiconductor Device Stripe Wire Wiring Resistance
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Solution Overview
Problem
The existing semiconductor devices with striped drain and source regions experience increased wiring resistance due to longer current paths from pad electrodes to stripe wires, which can be attributed to the configuration of wiring layers and insulating layers.
Innovation Solution
The semiconductor device incorporates comb-like extraction electrodes that shorten the current path from pad electrodes to stripe wires, reducing wiring resistance by increasing the number of connected wires and optimizing the layout of extraction electrodes and wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If stripe wire is formed extending from one end to the other end in the first wiring layer, then the wiring structure is simplified, but the current path becomes longer causing increased wiring resistance
Solution Approach 1:
The patent divides the wiring structure into multiple segments: the first wiring layer with stripe wires, the second wiring layer with pad electrodes, and extraction electrodes that connect them. This segmentation allows the current path to be optimized by creating multiple connection points rather than relying on a single long wire extension, thereby reducing overall wiring resistance while maintaining structural organization.
Solution Approach 2:
The patent introduces a vertical dimension by stacking the first and second wiring layers and using extraction electrodes to connect them. This three-dimensional wiring arrangement allows current to flow through multiple paths simultaneously (both horizontally in the stripe wire and vertically through extraction electrodes), effectively reducing the equivalent resistance without requiring excessively long horizontal wire extensions.
2Ease of manufacture
If pad electrode is positioned at the end portion of stripe wire, then the connection is simplified, but the current path length increases causing higher wiring resistance
Solution Approach 1:
The connection path is segmented into multiple sections: the stripe wire in the first wiring layer, the extraction electrodes垂直ly connecting to the second wiring layer, and the pad electrode. This segmentation creates multiple parallel current paths, reducing the effective resistance while maintaining manufacturing simplicity through standardized layer-by-layer construction.
Solution Approach 2:
The extraction electrodes serve as intermediary elements between the stripe wire and the pad electrode. These intermediaries provide additional connection points and create parallel current paths, effectively reducing the resistance between the pad electrode and the stripe wire without complicating the overall connection architecture.
3Reliability
If multiple extraction electrodes are added to shorten current path, then wiring resistance is reduced, but the device complexity increases
Solution Approach 1:
The extraction electrodes are merged with the existing two-wiring-layer structure rather than being added as completely separate components. They are integrated into the second wiring layer and connect to the stripe wires through the insulating layer, combining multiple functions (connection, current path reduction, and structural support) into a unified electrode system that minimizes overall complexity.
Solution Approach 2:
The extraction electrodes serve multiple functions: they act as connection conduits between wiring layers, provide additional current paths to reduce resistance, and maintain structural integrity of the wiring system. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity while achieving the goal of reduced wiring resistance.
Data Source
AI summary
The present disclosure provides a semiconductor device capable of reducing wiring resistance by using a stripe wire. The semiconductor device includes: a source pad electrode formed on a second interlayer insulating layer; a plurality of source extraction electrodes extracted in a first direction from the source pad electrode; a drain pad electrode formed on the second interlayer insulating layer; and a plurality of drain extraction electrodes extracted in the first direction from the drain pad electrode. The source pad electrode and the plurality of source extraction electrodes are electrically connected to a plurality of source wires of stripe wire covered by the second interlayer insulating layer. The drain pad electrode and the plurality of drain extraction electrodes are electrically connected to a plurality of drain wires of the stripe wire. The plurality of drain extraction electrodes are engaged with the plurality of source extraction electrodes.