Semiconductor Structure with Staged Gate Isolation for Fork Nanosheets

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Solution Overview

Problem

The performance of fork nanosheet devices in semiconductor structures is limited by the difficulty in maintaining accurate spacing and electrical isolation between NMOS and PMOS devices during the manufacturing process, leading to potential connectivity issues and reduced scalability.

Innovation Solution

A semiconductor structure is designed with a first and second isolation structure, where the top of the second isolation structure is lower than the first, allowing for separate formation of gate structures that are electrically connected or isolated, facilitating the creation of different devices on the same substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If a dielectric wall is introduced to physically isolate NMOS and PMOS gate grooves, then spacing between devices is reduced and scalability is improved, but manufacturing complexity increases due to additional isolation structure formation steps

Engineering Contradiction:
Improvespacing between NMOS and PMOS devicesVSAvoidforming process complexity
Core Design Contradiction:
Area of moving objectVSDevice complexity

Solution Approach 1:

The dielectric wall is formed in advance before gate patterning, physically isolating the NMOS and PMOS gate grooves from each other. This preliminary isolation structure enables subsequent gate formation processes to proceed independently for NMOS and PMOS devices, reducing the minimum spacing requirements between devices while maintaining manufacturing feasibility through staged process implementation

Inventive Principle:
Principle #10Preliminary action

2Reliability

If the top of the second isolation structure is made lower than the first, then gate structures can be separately formed with correct electrical isolation or connection, but structural complexity increases

Engineering Contradiction:
Improveelectrical isolation between gate structuresVSAvoidisolation structure height variation
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The isolation structures are designed with different heights in different regions: the first isolation structure has a higher top surface while the second isolation structure has a lower top surface. This localized height variation enables the first gate structure to be electrically isolated from the second gate structure through the height difference, providing reliable electrical isolation where needed while allowing flexibility in gate formation processes

Inventive Principle:
Principle #3Local quality

3Reliability

If fork nanosheet structure is used to improve channel control and drive current, then device performance is enhanced, but difficulty in maintaining accurate spacing and electrical isolation increases

Engineering Contradiction:
Improvechannel control capabilityVSAvoidspacing accuracy between devices
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The dielectric wall acts as an intermediary structure between the NMOS and PMOS fork nanosheet devices. This intermediate element provides physical and electrical isolation, enabling accurate spacing maintenance between the high-performance fork nanosheet structures while simplifying the manufacturing process by preventing unwanted interactions during gate formation

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS12389673B2Semiconductor structure and method of forming semiconductor structure
Publication Date: 2025.08.12 SEMICON MFG INT (SHANGHAI) CORP
  • US12389673B2 patent drawing
  • US12389673B2 patent drawing
  • US12389673B2 patent drawing

AI summary

Semiconductor structure and method of forming semiconductor structure are provided. The semiconductor structure includes a substrate, a first isolation structure, and a first nanostructure and a second nanostructure on two sides of the first isolation structure. The semiconductor structure also includes a second isolation structure, and a third nanostructure and a fourth nanostructure on two sides of the second isolation structure. A top of the second isolation structure is lower than a top of the first isolation structure. The semiconductor structure also includes a first gate structure and a second gate structure. The first gate structure and the second gate structure expose a top surface of the first isolation structure. The semiconductor structure also includes a third gate structure and a fourth gate structure. The third gate structure and the fourth gate structure are in contact with each other on a top surface of the second isolation structure.