Semiconductor Submount with Sidewall Feed-Throughs
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Solution Overview
Problem
The existing semiconductor packaging materials face challenges in efficiently managing heat and electrical feed-throughs, leading to increased package size and costs due to the need for additional area for planar and parallel electrical connections, which limits the miniaturization of consumer electronic devices.
Innovation Solution
A semiconductor submount design featuring a cavity with a thin silicon membrane portion at the bottom and thicker frame portions adjacent to the sidewalls, incorporating electrically conductive feed-through connections that extend through the frame portion, allowing for efficient electrical contact and reduced package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical feed-throughs are present in the planar and parallel surfaces of the package, then electrical connection is achieved, but the overall package area increases significantly
Solution Approach 1:
The patent transitions electrical feed-throughs from planar surface connections to three-dimensional sidewall connections. The feed-throughs extend vertically through the cavity sidewalls rather than lying flat on the package surface, utilizing the vertical dimension to achieve electrical connection without increasing the horizontal package footprint.
Solution Approach 2:
The patent creates localized electrical connection points at the cavity sidewalls where feed-throughs penetrate through specific regions. This concentrates the electrical connection function in localized areas rather than requiring extensive planar contact areas, allowing the rest of the package surface to remain compact.
2Ease of manufacture
If conventional packaging materials are used, then manufacturing is simplified, but thermal conductivity is insufficient leading to heat management issues
Solution Approach 1:
The patent employs a composite structure combining silicon substrate with copper or aluminum feed-through elements. The silicon provides mechanical support and can be manufactured using standard processes, while the copper/aluminum components provide high thermal conductivity pathways for heat dissipation from the LED device.
Solution Approach 2:
The patent changes the material parameter of the feed-throughs from conventional low-conductivity materials to high-conductivity metals (copper or aluminum). This parameter change in thermal conductivity allows efficient heat transfer from the LED to the package exterior while maintaining compatibility with existing semiconductor manufacturing processes.
3Area of stationary object
If the package size is reduced to fit consumer electronics, then device integration is improved, but thermal performance and electrical connection reliability deteriorate
Solution Approach 1:
The patent moves thermal management and electrical connection functions from the horizontal plane to the vertical dimension. Heat sinks and feed-throughs extend downward from the cavity, utilizing the vertical space within the compact package to provide adequate thermal and electrical pathways without increasing the horizontal footprint.
Solution Approach 2:
The patent uses thin silicon membrane portions at the cavity bottom that can be selectively removed or modified to create thermal pathways. These thin regions allow heat to conduct from the LED to the heat sink structure while maintaining the compact overall package dimensions.
4Adaptability or versatility
If a thin silicon membrane is used at the cavity bottom, then device mounting flexibility is improved, but structural strength is reduced
Solution Approach 1:
The patent creates a non-uniform thickness distribution in the silicon substrate, with thin membrane regions for flexibility and device mounting, and thicker frame regions for structural support. This local variation in thickness allows the structure to simultaneously achieve mounting flexibility where needed and structural strength where required.
Solution Approach 2:
The patent segments the silicon substrate into functionally distinct regions: a thin central membrane area for device mounting and access, and thicker peripheral frame areas for mechanical strength and support. This segmentation allows each region to be optimized for its specific function without compromising the other.
Data Source
Figure 1
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Figure 5A~5D
AI summary
A submount for a micro-component includes a semiconductor substrate having a cavity defined in a front-side of the substrate in which to mount the micro-component. The submount also includes a thin silicon membrane portion at a bottom of the cavity and thicker frame portions adjacent to sidewalls of the cavity. The substrate includes an electrically conductive feed-through connection extending from a back-side of the substrate at least partially through the thicker silicon frame portion. Electrical contact between the feed- through connection and a conductive layer on a surface of the cavity is made at least partially through a sidewall of the cavity.