Semiconductor Substrate Adapter Integration for Wire Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for contacting semiconductor elements in power electronics modules are unreliable and costly, particularly due to the use of aluminum metallization, which leads to failures and incompatibility with conventional wire bonding processes, and existing solutions are expensive and inefficient.
Innovation Solution
A method involving structuring an electrically conductive metal element, applying contacting material to a semiconductor element, and joining it with the metal element to form a substrate adapter directly on the semiconductor, reducing subsequent assembly steps and costs, using materials like copper or silver, and applying additional coatings and protective films for enhanced reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If aluminum metallization is used for chip metallization, then the conventional wire bonding process cannot be used, but the system life and reliability are reduced
Solution Approach 1:
The substrate adapter is integrated onto the semiconductor chip during the semiconductor manufacturing process itself, before the chip is completed and packaged. This preliminary integration ensures that the adapter and chip form a unified structure that maintains both wire bonding compatibility and long-term reliability, as the adapter is not added later as a separate component but is built in from the start.
Solution Approach 2:
The substrate adapter and semiconductor chip are merged into a single integrated structure. The adapter comprises a first substrate and a second substrate bonded together, with the semiconductor chip mounted on the first substrate. This merging eliminates the need for separate adaptation steps and ensures mechanical and electrical integrity throughout the product lifecycle.
2Reliability
If a metal element is provided with contacting material in a subsequent method step, then the semiconductor element can be connected, but the manufacturing cost increases significantly
Solution Approach 1:
The contacting material is applied to the metal element during the same manufacturing process step where the semiconductor chip is being prepared, rather than in a subsequent separate step. This preliminary application of contacting material allows both components to be processed simultaneously on the same production line, maintaining connection reliability while eliminating the need for expensive post-processing operations.
Solution Approach 2:
The manufacturing processes for the semiconductor chip and the metal element with contacting material are merged into a single integrated process flow. Both components are fabricated and prepared on the same substrate/transport element simultaneously, allowing for economies of scale and eliminating the need for separate handling and processing steps that would increase costs.
3Ease of manufacture
If aluminum metallization is used, then the contacting process encounters problems, but alternative solutions increase device complexity
Solution Approach 1:
The adapter is segmented into two separate substrates (first substrate and second substrate) that are bonded together. This segmentation allows each substrate to be optimized for its specific function - the first substrate for chip mounting and the second substrate for external connections - while maintaining overall structural simplicity and manufacturability.
Solution Approach 2:
The substrate adapter serves multiple functions: it provides mechanical support for the semiconductor chip, establishes electrical connections through the contacting material, and enables compatibility with conventional wire bonding processes. By designing the adapter to fulfill multiple roles, the overall module structure remains simple rather than requiring separate components for each function.
Data Source
Figure 1
Figure 2~3
AI summary
The invention relates to a method for manufacturing at least one semiconductor element (10', 10", 10'') with a substrate adapter (35', 35", 35''), comprising the steps of: - structuring an electrically conductive metal element (12), - applying a contacting material (11) to a first side (13) of a semiconductor element (10), wherein the semiconductor element (10) is arranged with a second side (14) on a transport element (20), - positioning the structured metal element (12) and the semiconductor element (10) such that a first side (21) of the structured metal element (12) and the first side (13) of the semiconductor element (10) provided with the contacting material (11) are arranged opposite each other, and - joining the structured metal element (12) with the semiconductor element (10) provided with the contacting material (11).