Semiconductor Module Substrate Positioning via Evaporative Adhesive
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Solution Overview
Problem
The existing methods for producing semiconductor modules face challenges in achieving high accuracy in the positioning and orientation of substrates with respect to carrier plates, leading to deviations that can result in manufacturing errors, leaks, and increased tolerance ranges, which affect the precise alignment of contacts and the overall performance of semiconductor modules.
Innovation Solution
The method involves applying adhesive to recesses on the edge of the bonding layer on the carrier plate or substrate, allowing for precise positioning without additional mounting frames, and using a bonding layer that can be melted or sintered to create a soldered or sintered connection, with the adhesive evaporating during the process to avoid residue and ensure accurate contact alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mounting frames or brackets are used to position the substrate on the carrier plate, then the substrate can be held in position during bonding, but positioning accuracy deteriorates due to frame dimensions, alignment errors, and required gaps
Solution Approach 1:
The patent removes the mounting frame or bracket from the positioning system entirely. Instead of using a frame to hold the substrate, the invention applies adhesive directly to the carrier plate surface, eliminating the intermediate framing structure that caused positioning errors due to its dimensions, alignment requirements, and necessary gaps around the substrate.
Solution Approach 2:
The adhesive is applied in an asymmetric pattern concentrated at specific locations (corners or edges) of the substrate rather than uniformly across the entire substrate surface. This localized adhesive application provides sufficient positioning accuracy while minimizing the adhesive amount and avoiding interference with the bonding layer areas.
2Manufacturing precision
If adhesive is applied over the entire substrate surface, then positioning accuracy improves, but the bonding layer area is reduced and manufacturing complexity increases
Solution Approach 1:
The adhesive is applied locally at specific areas (corners or edges) of the substrate rather than uniformly across the entire surface. This localized application provides sufficient positioning precision while leaving the central bonding layer area intact and unaffected, maintaining both positioning accuracy and bonding layer integrity.
Solution Approach 2:
The adhesive application is segmented into discrete locations (corners or edges) rather than a continuous uniform layer. This segmentation allows the adhesive to provide positioning function at critical points without covering the bonding layer areas, thus maintaining both positioning precision and bonding layer area.
3Stability of the object's composition
If frames or brackets are used for positioning, then substrate can be held steady, but additional components increase device complexity and potential error sources
Solution Approach 1:
The mounting frame or bracket is completely removed from the system. The substrate stability during bonding is achieved through adhesive application directly to the carrier plate, eliminating the need for separate framing components and reducing the overall device complexity.
Solution Approach 2:
The positioning function previously performed by the mounting frame is merged with the adhesive application process. The adhesive serves dual purposes: providing positioning accuracy and ensuring substrate stability during bonding, thereby eliminating the need for separate positioning components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy of substrate positioning, prevents leaks during encapsulation, and allows for high-precision alignment of semiconductor modules, reducing manufacturing rejects and ensuring reliable operation by maintaining precise contact alignment without additional components.
Implementation Method 1
the adhesive evaporating during the process to avoid residue and ensure accurate contact alignment
Implementation Method 2
bonding a substrate and the backing sheet via the bonding layer by fusing or sintering the bonding layer
Implementation Method 3
bonding a substrate and the backing sheet via the bonding layer by fusing or sintering the bonding layer
Data Source
Figure 1~3
Figure 4~5
AI summary
Method for manufacturing a semiconductor module (1) comprising the steps of: - providing a carrier plate (2) and a substrate (3) with a bonding layer (7) arranged on a surface (8) of the carrier plate (2) or the substrate (3), - applying adhesive (9) in several bonding areas (10) of the carrier plate (2) or the substrate (3) that are free of the bonding layer (7), - positioning the substrate (3) on the carrier plate (2) such that the substrate (3) and the carrier plate (2) are in contact with the bonding layer (7) and the adhesive (9), - joining the substrate (3) and the carrier plate (2) via the bonding layer (7) by melting or sintering the bonding layer (7).