Semiconductor Substrate Bonding Junction Estimation
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Solution Overview
Problem
In semiconductor devices, variations in bump heights during substrate bonding lead to non-joining issues and junction defects due to inadequate electrical connection between substrates.
Innovation Solution
A semiconductor device design system and manufacturing method that includes a numerical value acquiring part, junction estimating part, and change processing part to assess and adjust calculation parameters for optimal substrate alignment and pressure application, ensuring effective contact between terminal bumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If substrates are bonded with bumps of varying heights, then substrate bonding can proceed, but junction defects occur due to non-joining of low bumps
Solution Approach 1:
The system performs preliminary estimation of bump junction status before actual substrate bonding by calculating compression amounts and bending amounts based on design parameters. This allows identification of potential non-joining issues before they occur, enabling pre-bonding parameter optimization to ensure all bumps including low ones will achieve proper junction.
Solution Approach 2:
The system changes design parameters such as bump dimensions, substrate thickness, or bonding pressure to ensure that even the lowest bumps achieve sufficient compression for reliable junction. By adjusting these parameters based on the estimated compression and bending amounts, the system guarantees proper electrical connection across all bumps regardless of height variations.
2Reliability
If bonding pressure is increased to ensure low bump joining, then junction reliability improves, but substrate deformation increases
Solution Approach 1:
The system calculates the expected substrate bending amount based on design parameters before bonding. By knowing the predicted deformation in advance, engineers can compensate for it in the design phase or adjust bonding parameters accordingly, ensuring reliable bump junction without excessive substrate deformation.
Solution Approach 2:
The system optimizes the balance between bonding pressure and substrate deformation by adjusting design parameters. Instead of simply increasing pressure, the system may modify bump dimensions, substrate thickness, or material properties to achieve the necessary compression for low bump junction while keeping substrate deformation within acceptable limits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system reliably ensures electrical connection between substrates by adjusting parameters to achieve contact between bumps, preventing junction defects and improving the reliability of three-dimensionally laminated semiconductor devices.
Implementation Method 1
the respective substrates are pressed at a prescribed pressure so that the front end faces of the respective mutually corresponding terminals come into contact
Data Source
AI summary
The terminals that oppose each other when substrates are bonded are designed to be reliably joined. Comprised in a semiconductor device design system are a numerical value acquiring part, which acquires the respective numerical values of a plurality of calculation parameters, a junction estimating part, which, in the case in which a plurality of substrates has been pressed at a prescribed pressure so that the bump front end faces come into contact, estimates whether or not the respective mutually opposing bumps will be joined based on the respective numerical values of the calculation parameters acquired by the numerical value acquiring part, and a change processing part, which, in the case in which it has been estimated by the junction estimating part that any of the bumps will not be joined, gives a warning or performs processing so as to change the numerical value of at least one calculation parameter among the plurality of calculation parameters.