Semiconductor Substrate Capacitor Pad Segmentation for Noise Reduction
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Solution Overview
Problem
Semiconductor device substrates face challenges in maintaining stable power supply voltage due to fluctuations, leading to noise issues and potential malfunctions, especially when different semiconductor elements are mounted, as the parallel resonance frequency can shift closer to operating frequencies, causing noise and requiring fine-tuning of capacitance values which is not feasible with commercially available capacitors.
Innovation Solution
A semiconductor device substrate with a multi-layer wiring layer and multiple capacitor pads allows for the selection of different capacitor pads to mount decoupling capacitors, adjusting the parallel resonance frequency by varying the resistance and inductance values through wire connections, enabling the substrate to be used with multiple types of semiconductor elements and accommodating manufacturing variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a decoupling capacitor is provided between the ground pattern and the power supply pattern to stabilize the power supply voltage, then the power supply voltage stability is improved, but noise occurs in the semiconductor element and the semiconductor device substrate
Solution Approach 1:
The invention divides the capacitor pad into multiple segments (first capacitor pad and second capacitor pad) with different wiring configurations. Each segment has different resistance and inductance values, allowing selective use to optimize performance for different semiconductor elements while maintaining voltage stability and reducing noise.
Solution Approach 2:
Different regions of the capacitor pad structure are designed with different electrical characteristics. The first and second capacitor pads have different wire connections and pad configurations, creating local variations in resistance and inductance to address noise issues at specific locations and frequencies.
2Object-generated harmful factors
If the parallel resonance frequency is adjusted to reduce noise, then noise reduction is achieved, but the capacitance value requires fine-tuning which is not feasible with commercially available capacitors
Solution Approach 1:
Instead of changing the capacitance value of commercially available capacitors, the invention changes other parameters (resistance and inductance) by selecting different capacitor pad configurations. The different wire connections and pad structures provide different electrical characteristics, allowing resonance frequency adjustment without requiring custom capacitor manufacturing.
Solution Approach 2:
The capacitor pad structure acts as an intermediary element that modifies the electrical characteristics between the capacitor and the power supply network. By changing the pad configuration, the effective resistance and inductance are adjusted, which in turn adjusts the parallel resonance frequency without changing the capacitor itself.
3Adaptability or versatility
If different semiconductor elements are mounted on the substrate, then versatility is improved, but the parallel resonance frequency shifts closer to operating frequencies causing noise
Solution Approach 1:
The substrate is designed with multiple capacitor pad options (first and second capacitor pads) that can be selectively used depending on the semiconductor element being mounted. This universal design allows the same substrate to accommodate different semiconductor elements while maintaining optimal noise performance for each application.
Solution Approach 2:
The design allows dynamic selection of capacitor pad configuration based on the specific semiconductor element requirements. Different elements can utilize different pad structures to optimize their operating conditions, making the substrate adaptable to varying frequency requirements and noise characteristics of different devices.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces noise by selecting the appropriate capacitor pad to maintain a resonance frequency far from operating frequencies, ensuring stable operation across various semiconductor elements and reducing design and manufacturing complexities.
Implementation Method 1
a decoupling capacitor is provided between the ground pattern and the power supply pattern, and the fluctuation of the power supply voltage is absorbed by the decoupling capacitor to stabilize the power supply voltage
Implementation Method 2
adjusting the parallel resonance frequency by varying the resistance and inductance values through wire connections
Implementation Method 3
adjusting the parallel resonance frequency by varying the resistance and inductance values through wire connections
Implementation Method 4
adjusting the parallel resonance frequency by varying the resistance and inductance values through wire connections, enabling the substrate to be used with multiple types of semiconductor elements
Data Source
AI summary
There is provided a semiconductor device substrate including: a multi-layer wiring layer; a first capacitor pad which is provided on an uppermost layer of the multi-layer wiring layer, and which includes a first power supply pad connected to a power supply layer of the multi-layer wiring layer through a first via and a first ground pad connected to a ground layer of the multi-layer wiring layer through a second via; and a second capacitor pad which is provided on the uppermost layer of the multi-layer wiring layer, and which includes a second power supply pad connected to the first power supply pad through a first wire and a second ground pad connected to the first ground pad through a second wire.