Semiconductor Substrate Concavity Filler and Flat Plate Bonding Alignment
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Solution Overview
Problem
The existing techniques for bonding semiconductor chips face challenges due to surface irregularities caused by thickness variations, leading to deformation and height variations in terminal groups, which can result in bonding failures.
Innovation Solution
An electronic device is designed with a substrate having a concavity in one surface, filled with a filler and covered by a flat plate, to minimize deformation and ensure proper alignment and bonding of terminal groups across substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a semiconductor chip with a concavity in its surface is sucked and held for bonding, then the chip can be positioned and bonded to another chip, but the concavity causes the chip to deform leading to variation in bump height and bonding failure
Solution Approach 1:
A flat plate is placed on the back surface of the semiconductor chip before the bonding process to preliminarily flatten the chip surface. This preliminary action prevents deformation when the chip is subsequently sucked and held during bonding, ensuring uniform bump heights and successful bonding.
Solution Approach 2:
A flat plate is introduced as an intermediary element between the suction stage and the semiconductor chip. This intermediary distributes the suction force uniformly across the chip surface, preventing localized deformation at the concavity and maintaining chip flatness during bonding.
2Ease of operation
If the back surface of a semiconductor chip is sucked to hold it during bonding, then the chip can be manipulated and positioned, but surface irregularities cause deformation and height variation in terminal groups
Solution Approach 1:
The flat plate is placed on the chip back surface before handling and bonding operations. This preliminary flattening action ensures that subsequent suction and manipulation do not cause deformation, maintaining terminal group alignment precision while enabling easy chip handling.
Solution Approach 2:
The flat plate serves as an intermediary between the suction mechanism and the chip surface. It enables effective chip handling and positioning through uniform force distribution, while preventing deformation that would compromise terminal group alignment precision.
3Reliability
If a flat plate is placed over the concavity to maintain chip shape, then deformation is prevented and bonding reliability improves, but device structure becomes more complex
Solution Approach 1:
The flat plate performs multiple functions: it flattens the chip surface, distributes suction forces uniformly, prevents deformation during handling, and maintains chip shape during bonding. This multi-functionality justifies the additional structural element by eliminating the need for multiple separate components or processes.
Data Source
AI summary
An electronic device includes an electronic part including a first substrate having a group of first terminals over a first front surface and having a concavity in a back surface, a filler placed in the concavity, and a flat plate placed over the back surface with the filler therebetween, and further includes a second substrate disposed on the first front surface side of the first substrate and having a group of second terminals bonded to the group of first terminals over a second front surface opposite the first front surface. The filler and flat plate minimize deformation of the first substrate and variation in the distance between the group of first terminals and the group of second terminals caused by the deformation of the first substrate, which thereby reduces the occurrence of a failure in bonding together the group of first terminals and the group of second terminals.