Semiconductor Substrate Cooling via Laser-Modified Flow Paths
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Solution Overview
Problem
Conventional semiconductor device manufacturing methods with cooling mechanisms, such as cooling fins, become bulky and reduce cooling efficiency, especially for high-output devices, necessitating a more efficient and compact cooling solution.
Innovation Solution
The method involves forming a micro-flow path within the semiconductor device using laser processing to create modified regions that facilitate etching, allowing for direct coolant circulation without external cooling means, thereby enhancing cooling efficiency and reducing device size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If indirect cooling means such as cooling fins are used, then cooling function is provided, but device size becomes large and cooling efficiency is reduced
Solution Approach 1:
The cooling function is merged with the substrate itself by forming flow paths directly within the substrate structure. The substrate serves dual purposes as both the mounting platform for functional devices and the cooling mechanism, eliminating the need for separate cooling fins and reducing overall device volume while maintaining effective heat dissipation.
2Reliability
If indirect cooling means such as cooling fins are used, then cooling function is provided, but cooling efficiency is reduced
Solution Approach 1:
The cooling function is extracted from the functional devices and integrated into the substrate structure. By forming flow paths directly in the substrate, heat can be dissipated more efficiently through direct coolant contact with the substrate, reducing thermal resistance and improving overall cooling efficiency compared to indirect cooling through separate fins.
3Reliability
If separate cooling means are provided, then cooling function is achieved, but device complexity increases
Solution Approach 1:
The cooling mechanism is combined with the substrate structure by forming flow paths directly within the substrate. This integration eliminates the need for separate cooling fins and associated mounting structures, simplifying the overall device architecture while maintaining effective cooling functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the manufacturing of semiconductor devices with improved cooling efficiency and reduced size by integrating a coolant circulation path within the device, eliminating the need for separate cooling mechanisms.
Implementation Method 1
converging a laser light into an object to be processed, thereby forming a modified region within the object
Implementation Method 2
converging a laser light into an object to be processed, thereby forming a modified region within the object
Implementation Method 3
advancing an etching selectively along the modified region, thereby forming a flow path within the object
Data Source
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AI summary
A method for manufacturing a semiconductor device having a cooling mechanism comprises a modified region forming step of converging a laser light at a sheet-like object to be processed made of silicon so as to form a modified region within the object along a line to form a modified region, an etching step of anisotropically etching the object after the modified region forming step so as to advance the etching selectively along the first modified region and form a flow path for circulating a coolant as a cooling mechanism within the object, and a functional device forming step of forming a functional device on one main face side of the object.