Semiconductor Chip Substrate Selection via Cost-Performance FOM
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Solution Overview
Problem
Existing methods for manufacturing semiconductor chips and modules based on the figure of merit (FOM) fail to consider manufacturing costs, leading to increased production costs even when desired electrical performance is achieved.
Innovation Solution
A new FOM equation that incorporates both electrical performance and manufacturing cost is used to compare semiconductor chips and modules on different substrates, allowing for the selection of the most cost-effective substrate for production, thereby reducing costs while maintaining electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the FOM is used to determine electrical performance of semiconductor chips, then electrical performance is improved, but manufacturing cost increases
Solution Approach 1:
The patent modifies the FOM equation by adding a cost coefficient (α) that weights the manufacturing cost term. This transforms the traditional FOM (which only considers electrical characteristics like on-resistance and charge density) into a new FOM that balances both electrical performance and manufacturing cost. By adjusting α, manufacturers can optimize the balance between performance and cost, resolving the contradiction between achieving high electrical performance and controlling manufacturing costs.
2Reliability
If semiconductor chips are manufactured to satisfy desired performance, then electrical performance is improved, but manufacturing cost rises
Solution Approach 1:
The patent introduces a cost coefficient (α) in the modified FOM equation that allows manufacturers to adjust the weight given to manufacturing cost versus electrical performance. By changing this parameter, the system can optimize the balance between achieving desired electrical performance and controlling manufacturing costs, directly resolving the contradiction stated.
Data Source
AI summary
An FOM (figure of merit) enabling evaluation from a cost aspect, as well as evaluation of electrical performance, is newly proposed to provide a method of manufacturing based on the FOM a semiconductor chip intended for a lower cost production in addition to satisfying electrical performance. An FOMC of a semiconductor chip is defined as the product of a term represented by electrical performance of a substrate S and a term represented by a semiconductor chip cost CC; the FOMC of each of the semiconductor chips on substrates SS, SC of different type is determined by calculation of the product thereof. Based on the magnitudes of the calculation results, a desired substrate is selected from the substrates SS, SC and then a semiconductor chip is fabricated by forming a semiconductor element on the desired substrate selected.