Semiconductor Package Substrate Geometry for Heat Dissipation Reliability
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Solution Overview
Problem
Semiconductor devices face challenges in improving heat dissipation properties while maintaining reliability, as thermal stress can lead to separation of the sealing body from the substrate, degrading insulating and connection reliability.
Innovation Solution
A semiconductor device design featuring a substrate with an insulating base member and exposed back-face metal body, where the laminate has inclined portions that suppress separation and enhance heat dissipation by diffusing heat generated from the semiconductor element effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sealing body is tightly sealed to the substrate to maintain reliability, then reliability is improved, but thermal stress accumulates and causes separation of the sealing body from the substrate
Solution Approach 1:
The side face of the laminate includes inclined portions that create a curved or angled transition zone between the front face and the exposed face of the back-face metal body. This curvature distributes thermal stress more evenly and prevents concentrated stress at sharp corners, thereby reducing separation while maintaining sealing reliability.
Solution Approach 2:
The inclination angle and dimensions of the inclined portions are specifically designed to optimize the balance between sealing reliability and thermal stress resistance. By changing geometric parameters of the laminate structure, the device achieves both tight sealing and stress distribution.
2Temperature
If the back-face metal body is exposed from the sealing body to improve heat dissipation, then heat dissipation is improved, but the sealing body becomes more prone to separation
Solution Approach 1:
The inclined portions on the side face create a gradual transition zone that reduces stress concentration at the exposed edge of the back-face metal body. This allows the metal body to be exposed for heat dissipation while the inclined geometry prevents separation by distributing thermal expansion stresses.
Solution Approach 2:
The inclined portions are localized at specific regions where stress concentration occurs, providing targeted stress relief at the exposed face transition zones while maintaining the overall sealing structure integrity.
3Ease of manufacture
If the laminate has a simple flat structure to reduce manufacturing complexity, then ease of manufacture is improved, but thermal stress concentration causes separation
Solution Approach 1:
The inclined portions can be formed using standard molding or machining processes, adding minimal manufacturing complexity while significantly improving stress distribution and preventing separation at the exposed face transitions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design ensures reliability and improves heat dissipation properties by reducing thermal resistance and preventing separation, effectively managing thermal stress and enhancing the device's performance.
Implementation Method 1
enhance heat dissipation by diffusing heat generated from the semiconductor element effectively
Implementation Method 2
reducing thermal resistance
Implementation Method 3
thermal stress can lead to separation of the sealing body from the substrate
Data Source
AI summary
A semiconductor device includes a semiconductor element having main electrode on opposite faces in a plate thickness direction, a substrate, and a sealing body. The substrate has an insulating base member, a front-face metal body, and a back-face metal body having an exposed face exposed from the sealing body. A laminate of the insulating base member and the back-face metal body has a side face connecting between a front face of the insulating base member and the exposed face of the back-face metal body. The side face includes a first inclined portion in a predetermined range from the front face and a second inclined portion in a predetermined range from the exposed face. In a plan view of the substrate viewed along the plate thickness direction, a length of the second inclination portion is shorter than a length of the first inclination portion.