Semiconductor Substrate With Segmented Metal Board Creepage
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Solution Overview
Problem
Conventional substrates for semiconductor devices experience heat stress-induced solder overflow from the insulating substrate, which reduces insulation properties and leads to reliability issues.
Innovation Solution
A substrate design featuring an insulating substrate with a first metal board having distinct corner and center portions, optimized creepage distances, and a second metal board with a smaller volume, to prevent solder overflow and enhance heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional substrate design with uniform metal board is used, then manufacturing is simple, but heat stress causes solder overflow from the insulating substrate
Solution Approach 1:
The first metal board is designed with different creepage distances for different regions: corner portions have smaller creepage distances while center portions have larger creepage distances. This local differentiation prevents solder overflow at critical corner areas while maintaining adequate insulation elsewhere, resolving the contradiction between reliability and uniform manufacturing simplicity.
Solution Approach 2:
The metal board configuration is segmented into corner portions and center portions with distinct geometric characteristics. This segmentation allows each region to be optimized for its specific functional requirements - corners for solder containment and centers for heat dissipation - thereby preventing solder overflow without requiring complete redesign of the entire substrate structure.
2Reliability
If the creepage distance is increased to prevent solder overflow, then insulation properties improve, but the metal board area decreases
Solution Approach 1:
Instead of uniformly increasing creepage distance across the entire metal board, the design applies larger creepage distances only to corner portions where solder overflow is most likely. The center portions maintain smaller creepage distances, preserving metal board area for heat dissipation while still achieving adequate insulation through localized creepage enhancement at critical areas.
3Temperature
If a larger metal board is used for better heat dissipation, then heat management improves, but solder overflow risk increases
Solution Approach 1:
The first metal board uses larger creepage distances at corner portions to prevent solder overflow while maintaining adequate metal board area for heat dissipation. This localized creepage distance optimization allows the metal board to serve dual functions: sufficient area for thermal management and adequate creepage for electrical insulation at critical locations.
Solution Approach 2:
The metal board is functionally segmented into corner regions optimized for solder containment through larger creepage distances and center regions optimized for heat dissipation through adequate metal area. This segmentation resolves the contradiction by allowing each region to fulfill its primary function without compromising the other.
Data Source
AI summary
Provided is a substrate for semiconductor devices comprising: an insulating substrate; and a first metal board having a plurality of sides and formed on a first surface of the insulating substrate; wherein the first metal board includes: a corner portion positioned closer to a corner of a first side of the first metal board, for which a creepage distance between an edge of the first metal board and an edge of the insulating substrate reaches a smallest value for the first side; and a center portion positioned closer to a center of the first side than the corner portion, for which a creepage distance between the edge of the first metal board and the edge of the insulating substrate exceeds the smallest value; wherein a range of the center portion is larger than a range of the corner portion.