Semiconductor Substrate Notch Position Detection via Extraction
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Solution Overview
Problem
The existing methods for manufacturing semiconductor devices with glass substrates as supporting substrates face issues with debris accumulation at notches, which obstruct light detection and increase manufacturing costs due to the need for expensive image processing systems for position detection.
Innovation Solution
A method involving the preparation of semiconductor and supporting substrates with notches, where the semiconductor substrate is laminated with the supporting substrate to ensure the notch on the semiconductor substrate is exposed and can be directly detected, allowing for accurate position determination and reducing debris interference, and through holes are formed to connect the main and rear surfaces for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a light transmission protective member (glass substrate) is laminated with the semiconductor substrate to mechanically reinforce it, then the mechanical strength is improved, but debris accumulates at the notch and obstructs light detection
Solution Approach 1:
The harmful debris accumulation at the notch is eliminated by extracting the protective member from the lamination structure. The patent describes that when the protective member is not laminated with the semiconductor substrate, the notch remains exposed and accessible for light detection without obstruction from debris that would otherwise accumulate during film formation processes.
Solution Approach 2:
The protective function is segmented from the lamination structure. Instead of having the protective member serve both mechanical reinforcement and light transmission functions simultaneously in a laminated state, the patent separates these functions: the notch is kept exposed for position detection, while the semiconductor substrate itself provides the necessary mechanical support.
2Reliability
If insulating films and conductive layers are formed on the semiconductor substrate, then electrical connections are established, but debris from these films gets stuck at the notch
Solution Approach 1:
The harmful effect of debris accumulation is extracted by removing the lamination structure that causes it. The patent explains that without the protective member laminated to the semiconductor substrate, the notch remains open and does not trap debris generated during the formation of insulating films and conductive layers, thus maintaining both electrical connection reliability and clean optical detection.
3Object-affected harmful factors
If the notch is covered by the supporting substrate, then mechanical protection is provided, but light cannot pass through for position detection
Solution Approach 1:
The protective member is extracted from the lamination configuration to restore light transmission. The patent describes that by not laminating the protective member with the semiconductor substrate, the notch remains exposed and light can pass through freely for position detection, while the semiconductor substrate itself provides adequate mechanical protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy of position detection and reduces manufacturing costs by enabling direct light detection of the notch and efficient film-forming processes, while maintaining the mechanical reinforcement provided by the supporting substrate.
Implementation Method 1
a light is irradiated at the periphery of the semiconductor substrate so as to detect the light passed through the notch, and thus, detect the position of the semiconductor substrate
Data Source
AI summary
A method for manufacturing a semiconductor device, includes: preparing a semiconductor substrate with a first notch; preparing a supporting substrate with a second notch; laminating the semiconductor substrate with the supporting substrate so that the first notch can be matched with the second notch; and processing a second main surface of the semiconductor substrate opposite to a first main surface thereof facing to the supporting substrate to reduce a thickness of the semiconductor substrate to a predetermined thickness.