Semiconductor Substrate Debonding via Photodegradable Adhesive
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Solution Overview
Problem
The manufacturing process of semiconductor device packages often results in substrate cracking due to high pressure from clamps during the molding process, especially as substrate thicknesses decrease with advancements in technology.
Innovation Solution
A method involving a carrier substrate with a light-transmitting material and a cavity that accommodates the substrate, where a support portion forms a coplanar surface with the substrate, dispersing pressure and preventing cracking by using a photodegradable adhesive for easy debonding and a molding process that covers the semiconductor chip.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a clamp is used to define a molding portion by pressing the substrate, then the molding process can be performed, but substrate cracking occurs due to high pressure
Solution Approach 1:
The substrate is divided into a molded region and an unmolded region, with the clamp only pressing the edge region. This segmentation allows molding to be performed while avoiding high pressure on the entire substrate, preventing cracking in the semiconductor device region.
Solution Approach 2:
Different regions of the substrate are treated differently: the edge region is pressed by the clamp for molding definition, while the central region containing the semiconductor device is protected from high pressure. This local differentiation resolves the contradiction between enabling molding and preventing substrate cracking.
2Manufacturing precision
If substrate thickness is reduced to advance manufacturing processes, then manufacturing precision is improved, but substrate cracking is exacerbated under clamp pressure
Solution Approach 1:
By segmenting the pressed region to only the substrate edge, the mechanical stress is localized away from the thin central region. This allows thin substrates to be used for manufacturing precision while avoiding cracking by preventing high pressure application to the entire substrate surface.
3Ease of operation
If a light-transmitting carrier substrate with cavity is used, then substrate assembly can be debonded using light, but device complexity increases
Solution Approach 1:
The mechanical debonding process is replaced with optical energy. A light-transmitting carrier substrate with cavity is used, allowing light to pass through and debond the substrate assembly from the carrier. This substitutes mechanical separation with optical field action, improving ease of operation despite increased structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces substrate cracking and ensures reliable encapsulation of semiconductor devices by dispersing pressure and facilitating easy separation, thereby enhancing the structural integrity and manufacturing reliability of semiconductor device packages.
Implementation Method 1
a lower surface of the substrate assembly is bonded to a carrier substrate through a photodegradable adhesive layer, of which adhesion becomes weak when light is irradiated thereonto
Data Source
AI summary
A method for manufacturing a semiconductor device package includes: accommodating a substrate in a cavity in a center of a carrier substrate having the cavity in which a substrate with a semiconductor chip mounted thereon is accommodated in the center, having a support portion in contact with a side wall of the cavity to form an upper surface of the side wall and surrounding the cavity, and formed of a light-transmitting material; defining a molding portion of the substrate by pressing the support portion and an edge region of the substrate; and molding the molding portion, to cover the semiconductor chip.