Semiconductor Packaging Substrate With Recessed Thermal Via Cooling
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Solution Overview
Problem
Conventional semiconductor packages face issues with heat dissipation, leading to warpage due to thermal expansion, which increases defect rates, and traditional solutions like interposer layers increase package thickness.
Innovation Solution
A semiconductor packaging substrate with a recessed surface and thermal conductive vias penetrating through it, made from materials like glass or ceramic, which helps in heat dissipation without significantly increasing the package thickness, using a manufacturing method that includes forming vias and recesses and filling them with thermally conductive materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional semiconductor packages are used without additional heat dissipation structures, then the package thickness remains small, but heat dissipation is insufficient leading to warpage and increased defect rates
Solution Approach 1:
The substrate is segmented into multiple functional layers including a first substrate layer, a second substrate layer, and an interposer layer, with heat dissipation vias distributed throughout. This segmentation allows heat to be dissipated at multiple levels and locations simultaneously, improving overall heat dissipation capability without requiring a single thick heat sink structure.
Solution Approach 2:
Heat dissipation vias are nested within the substrate structure, with first heat dissipation vias extending through the first substrate layer and second heat dissipation vias extending through the second substrate layer. The interposer layer is nested between these layers, creating a nested configuration that maximizes heat dissipation surface area within the existing package thickness.
2Temperature
If interposer layers or heat dissipation layers are added to improve heat dissipation, then thermal stability improves, but the package thickness increases
Solution Approach 1:
Heat dissipation is achieved by transitioning from a planar heat dissipation approach to a three-dimensional via-based approach. Heat dissipation vias extend vertically through multiple substrate layers, utilizing the thickness dimension for heat conduction while maintaining a compact overall package footprint. This allows improved thermal stability without proportionally increasing package thickness.
Solution Approach 2:
The substrate structure uses composite materials with different thermal properties - the first and second substrate layers may have different material compositions than the interposer layer, allowing optimization of heat dissipation pathways. The heat dissipation vias are filled with conductive materials that have high thermal conductivity, creating a composite structure that achieves superior thermal stability within constrained thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively mitigates the warpage phenomenon by improving thermal stability and reducing thermal resistance, allowing for a more integrated and thinner semiconductor package with enhanced performance.
Implementation Method 1
plurality of first vias that penetrating the recessed surface and the other surface, wherein the plurality of first vias includes a thermal conductive material
Implementation Method 2
when a semiconductor package including a heating element does not dissipate heat properly, since each package components has its distinguishable thermal expansion coefficient, warpage phenomenon may occur
Data Source
AI summary
Embodiments relate to a semiconductor packaging substrate, a semiconductor packages, and a method for manufacturing the semiconductor packaging substrate, wherein a substrate comprising a one surface, other surface facing the one surface, a recessed surface that the one surface recessed, and a side wall connecting the one surface and the recessed surface; and plurality of first vias that penetrating the recessed surface and the other surface; wherein the plurality of first vias include a thermally conductive material. Embodiments have an excellent heat dissipation effect and can prevent warpage on the surface of the substrate due to thermal expansion.