Semiconductor Substrate Segmentation for Delamination Prevention
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Solution Overview
Problem
Conventional semiconductor package manufacturing processes are inefficient, leading to increased costs and productivity losses due to the need for numerous processing steps and frequent delamination of encapsulants caused by solder mask contamination.
Innovation Solution
A substrate for semiconductor packages is designed with a reduced number of processing steps, featuring an insulation layer with conductive patterns and a solder mask on one surface, and an adhesive on the other, along with metal layers and via patterns to facilitate efficient electrical connections and prevent delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a solder mask is formed on the surface of the substrate, then the conductive patterns are protected, but the thickness of the package increases and encapsulant delamination occurs due to surface contamination
Solution Approach 1:
The substrate is divided into two separate substrates: a first substrate with conductive patterns and a second substrate without solder mask contamination. These substrates are bonded together, segregating the protective function from the mounting surface to prevent encapsulant delamination while maintaining conductive pattern protection.
Solution Approach 2:
An adhesive layer is introduced as an intermediary between the first and second substrates. This adhesive mediator enables bonding while isolating the clean second substrate surface from the contaminated first substrate, preventing encapsulant delamination.
2Manufacturing precision
If multiple processing steps are used to manufacture the substrate, then the conductive patterns and solder mask are formed properly, but productivity decreases and manufacturing cost increases
Solution Approach 1:
The manufacturing process is segmented into separate steps for different substrates. The first substrate undergoes complete processing including solder mask formation, while the second substrate is prepared separately and then bonded. This segmentation allows parallel processing and reduces the total number of steps required for the final assembly.
Solution Approach 2:
The first substrate is fully processed with conductive patterns and solder mask formed in advance before bonding. This preliminary action allows subsequent bonding and encapsulation to proceed without requiring additional solder mask processing steps, improving overall manufacturing efficiency.
3Reliability
If adhesive is applied separately in a dedicated process, then the semiconductor chip can be attached properly, but productivity decreases and adhesive contamination occurs
Solution Approach 1:
The adhesive layer is formed in advance on the first substrate during the substrate preparation phase, before the semiconductor chip attachment process. This preliminary application of adhesive eliminates the need for a separate adhesive application step later, improving productivity while ensuring proper chip attachment.
Solution Approach 2:
The adhesive application process is merged with the substrate preparation process. The adhesive is applied to the first substrate along with other preparatory steps, combining multiple functions into a single integrated process flow that improves efficiency.
Data Source
AI summary
A method for manufacturing a substrate for a semiconductor package includes the steps of attaching first and second insulation layers which have first surfaces and second surfaces and are formed with conductive layers on the first surfaces, by the medium of a release film which has adhesives attached to both surfaces thereof, such that the second surfaces of the first and second insulation layers face each other; forming first conductive patterns on the first surfaces of the first and second insulation layers by patterning the conductive layers; forming solder masks on the first surfaces of the first and second insulation layers including the first conductive patterns to open portions of the first conductive patterns; and separating the first and second insulation layers from each other by removing the release film.