Semiconductor Substrate Placement Using Support Pins
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Solution Overview
Problem
Semiconductor substrates often misalign during transfer due to air resistance, leading to positional inaccuracies and potential damage during placement on work tables, as they lack sufficient support to counteract floating effects before contact.
Innovation Solution
A method involving a work table with support pins that move in an up-and-down direction to support the substrate at multiple points, ensuring precise placement by dispersing air resistance forces and preventing shifting during contact with the support plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the substrate is dropped from the arm to place it on the work table, then the substrate placement speed is improved and excessive stress is reduced, but the substrate may slip due to air resistance causing misalignment
Solution Approach 1:
The patent introduces support pins as an intermediary element between the substrate and the work table. These pins provide temporary support during the dropping process, acting as a mediator that prevents the substrate from slipping due to air resistance while maintaining the benefits of dropping (speed and stress reduction). The support pins are strategically positioned to support the substrate's weight during transfer, ensuring accurate positioning without requiring the substrate to be fully supported throughout the entire process.
2Stress or pressure
If the substrate is held and released slightly above the work table to drop it, then the stress applied to the substrate is reduced, but the substrate may float due to air resistance before contact
Solution Approach 1:
The support pins serve as a stabilizing intermediary during the transfer process. They provide localized support at critical points where air resistance causes floating, without requiring continuous support that would increase stress. The pins are positioned to counteract the floating effect caused by air resistance while allowing the substrate to be dropped from a height that reduces overall stress.
Solution Approach 2:
The patent applies support only at specific local points (where the support pins are positioned) rather than providing uniform support across the entire substrate. This local quality approach allows the substrate to be supported where needed to counteract air resistance effects, while maintaining the ability to drop from height to reduce overall stress on the substrate.
3Manufacturing precision
If the substrate is transferred using a camera or sensor for alignment, then the positioning accuracy is improved, but the process complexity and time increase
Solution Approach 1:
The support pins act as a mechanical intermediary that provides inherent positioning stability during transfer, reducing or eliminating the need for complex camera or sensor-based alignment systems. By providing physical support at critical points, the pins ensure accurate positioning through mechanical means rather than requiring sophisticated detection and adjustment systems.
Data Source
AI summary
A method of manufacturing at least one semiconductor device includes: providing a substrate having a flat lower surface, and an upper surface that allows mounting of at least one semiconductor element or an upper surface having at least one semiconductor mounted thereon; providing a work table having a support plate with a flat support surface for placing the substrate, and having a plurality of support pins arranged at a support surface side and configured to move along an up-and-down direction; abutting the lower surface of the substrate upon tip portions of the plurality of support pins to press down so that the lower surface of the substrate abuts upon the support surface of the support plate; and fixing the substrate on the support plate and performing one or more operations on the substrate.