Embedded Semiconductor Substrate Shielding for EMI and Via Reliability
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Solution Overview
Problem
Existing embedded substrate technologies face challenges in efficiently integrating electronic components with effective electromagnetic interference (EMI) shielding, leading to increased package size and manufacturing costs due to external shielding layers and issues with residual glass fibers causing electric disconnection.
Innovation Solution
The substrate structure incorporates a conductive via penetrating through the dielectric layer to form a built-in shielding structure surrounding the electronic components, using conductive layers for EMI protection and reducing package size by integrating the shielding within the substrate, thus avoiding costly external shielding methods and minimizing glass fiber residuals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If external shielding layers are used for EMI protection, then EMI shielding effectiveness is improved, but package size increases
Solution Approach 1:
The patent merges the shielding structure with the substrate by integrating conductive via structures directly into the substrate layers. The conductive via penetrates through dielectric layers and connects conductive planes, forming an embedded shielding structure that provides EMI protection without requiring external shielding layers, thus reducing overall package size while maintaining shielding effectiveness.
Solution Approach 2:
The shielding structure is nested within the substrate itself, with conductive via and conductive planes embedded inside the dielectric layers. This nested configuration allows the shielding function to be incorporated within the existing substrate architecture, eliminating the need for separate external shielding components and reducing package volume.
2Object-affected harmful factors
If external shielding layers are used for EMI protection, then EMI shielding effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
The shielding structure is combined with the substrate manufacturing process itself. The conductive via is formed by penetrating through dielectric layers and connecting existing conductive planes, utilizing the same fabrication techniques already employed for creating interconnect structures. This integration eliminates the need for separate external shielding component attachment processes, reducing manufacturing complexity and cost.
3Volume of stationary object
If conductive via is embedded in dielectric layer, then package size is reduced, but risk of electric disconnection from glass fiber residuals increases
Solution Approach 1:
The patent applies local quality by positioning the conductive via in specific locations within the dielectric layer where it can effectively shield electronic components while minimizing exposure to glass fiber residuals. The via is strategically placed to create shielding zones around sensitive components, providing localized EMI protection while reducing the statistical probability of encountering glass fiber contamination that could cause electrical disconnection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces package size, lowers manufacturing costs, and enhances EMI protection by embedding the shielding structure, preventing electronic component interference and addressing issues of electric disconnection.
Implementation Method 1
The first conductive via and at least one of the first conductive layer and the second conductive layer define a first shielding structure surrounding the electronic component
Data Source
AI summary
The present disclosure provides a substrate structure. The substrate structure includes an interconnection structure, a dielectric layer on the interconnection structure, an electronic component embedded in the dielectric layer, and a first conductive via penetrating through the dielectric layer and disposed adjacent to the electronic component. The interconnection structure includes a carrier having a first surface and a second surface opposite to the first surface, a first conductive layer disposed on the first surface of the carrier, and a second conductive layer disposed on the second surface of the carrier. The first conductive via and at least one of the first conductive layer and the second conductive layer define a first shielding structure surrounding the electronic component. A method of manufacturing a substrate structure is also disclosed.