Semiconductor Package Substrate Warpage Reduction via Thermal Bending
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Solution Overview
Problem
Semiconductor package substrates experience warpage during the separation process from carrier substrates, leading to manufacturing challenges and increased costs due to residual attachment and yield reduction.
Innovation Solution
A method involving heating the semiconductor package substrate to form predetermined bends and then cooling it to reduce warpage, utilizing a device with support and pressing members to exert compressive forces and shape the substrate into a wave or embossed form.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the package substrate is separated from the carrier substrate, then the semiconductor packages can be individually processed and mounted, but warpage occurs in the package substrate leading to manufacturing defects
Solution Approach 1:
The patent applies preliminary action by forming bends in the package substrate before separation from the carrier substrate. The bending process is performed while the substrate is still attached to the carrier, allowing the substrate to be pre-shaped to compensate for expected warpage. This preliminary bending action ensures that when the substrate is later separated and undergoes thermal or mechanical changes, the pre-formed bends counteract the warpage, maintaining manufacturing precision while enabling individual package processing.
2Stability of the object's composition
If the package substrate is made more rigid to prevent warpage, then substrate stability improves, but manufacturing flexibility and cost-effectiveness decrease
Solution Approach 1:
The patent applies parameter changes by modifying the physical state of the package substrate through thermal treatment during the bending process. By heating the substrate to increase its ductility and then applying mechanical force to form bends, the substrate can be shaped without requiring excessive rigidity. After cooling, the substrate maintains the bent shape with improved stability. This approach achieves substrate stability through controlled parameter changes rather than increasing material rigidity, preserving manufacturing flexibility.
3Manufacturing precision
If heating and bending processes are applied to the substrate, then warpage is reduced, but process complexity increases
Solution Approach 1:
The patent applies merging by combining the heating and bending operations into a single integrated process step. The substrate is heated and bent simultaneously or in immediate sequence while still attached to the carrier substrate, rather than as separate discrete operations. This consolidation reduces equipment requirements and process complexity while achieving effective warpage control through the coordinated thermal-mechanical treatment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively minimizes warpage, enhances manufacturing flexibility, and reduces costs by eliminating the need for a carrier substrate, resulting in improved substrate stability and reduced manufacturing defects.
Implementation Method 1
heating the semiconductor package substrate
Implementation Method 2
cooling the semiconductor package substrate
Data Source
AI summary
Embodiments disclosed are directed to a method of reducing warpage of a semiconductor package substrate, and a warpage reducing device. The method includes preparing the semiconductor package substrate, heating the prepared semiconductor package substrate, forming at least one bend in the heated semiconductor package substrate, and cooling the semiconductor package substrate having the at least one bend is formed.