Semiconductor Package Substrate Warping Prevention
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Solution Overview
Problem
The challenge is to prevent warping of semiconductor packages during fabrication, which occurs due to their design being made thinner and slimmer, affecting the functionality of semiconductor devices.
Innovation Solution
A substrate for semiconductor packages is designed with a first wiring substrate, a support carrier, and an adhesive film to increase the thickness and prevent warping, including a separator film to divide the adhesive film into parts for separation during fabrication, ensuring proper alignment and connection of semiconductor chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor package is designed to be thinner and slimmer, then the size and profile of the semiconductor product is reduced, but the semiconductor package becomes warped affecting functionality
Solution Approach 1:
The patent introduces a support carrier positioned beneath the wiring substrate to provide additional structural support in the vertical dimension. This carrier has a larger area than the wiring substrate, creating a stable base that prevents warping while allowing the active components to maintain a thin profile. The support structure effectively adds dimensional stability without increasing the functional thickness of the semiconductor package.
Solution Approach 2:
The patent employs a composite structure consisting of multiple layers including the wiring substrate, adhesive film, and support carrier. This composite construction combines materials with different mechanical properties to achieve both thinness and stability. The adhesive film bonds the thinner wiring substrate to the larger support carrier, creating a composite assembly that resists warping while maintaining the required compact size.
2Stability of the object's composition
If the thickness of the semiconductor package is increased to prevent warping, then warping is reduced, but the size of the semiconductor product increases
Solution Approach 1:
The patent divides the support structure into functionally distinct segments: the wiring substrate that carries electronic components and the support carrier that provides mechanical stability. The wiring substrate maintains a thin profile for compactness, while the support carrier extends beneath it to provide warping prevention. This segmentation allows each component to be optimized independently for its specific function.
Solution Approach 2:
The adhesive film serves as an intermediary layer that bonds the wiring substrate to the support carrier. This intermediate layer transfers mechanical loads between the two substrates and ensures stable attachment, allowing the thin wiring substrate to be supported by the larger carrier without direct contact, thus maintaining both thinness and stability.
3Stability of the object's composition
If a support carrier is added to prevent warping, then warping is reduced, but the structural complexity of the substrate increases
Solution Approach 1:
The support carrier performs multiple functions: it provides mechanical support to prevent warping, serves as a mounting surface for external terminals, and acts as a stable base during the fabrication process. By consolidating these functions into a single component, the patent avoids the need for multiple separate structural elements, thereby reducing overall complexity despite adding the carrier.
Solution Approach 2:
The patent modifies key parameters of the substrate structure, specifically the area and thickness distribution. The support carrier has a larger area than the wiring substrate and is positioned at a different vertical level, creating a parameter-based solution that prevents warping through geometric configuration rather than complex mechanical arrangements. This parameter change approach simplifies the overall structure compared to alternative warping prevention mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents contact failure between semiconductor chips and the package substrate, maintaining the functionality of semiconductor devices by reducing warping and allowing for efficient fabrication processes.
Implementation Method 1
an adhesive film to connect the second surface and the first support carrier
Data Source
AI summary
A substrate of a semiconductor package includes a first wiring substrate having a first surface and a second surface facing each other, the first surface having a semiconductor chip mounted thereon, a first support carrier, and an adhesive film connecting the second surface and the first support carrier.