Semiconductor Device Substrate Wiring Design
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Solution Overview
Problem
The miniaturization of semiconductor chips leads to increased wire resistance and signal interference due to narrower wiring widths, which existing techniques attempt to address by forming additional wiring or increasing thickness, resulting in higher production costs and yield deterioration.
Innovation Solution
A semiconductor device design where internal wirings connecting circuits are omitted within the chip, and substrate wirings on an insulating substrate electrically connect separate circuits, allowing for wider line widths and reduced signal interference without increasing chip size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the chip size is decreased for miniaturization, then the device size is reduced, but the wiring width decreases and wire resistance increases
Solution Approach 1:
The patent divides the wiring function into two segments: internal wirings within the chip and substrate wirings on the external substrate. By separating these functions, the internal wirings can be optimized for compact chip layout while substrate wirings provide low-resistance connections, resolving the contradiction between miniaturization and wire resistance
Solution Approach 2:
The patent moves the wiring connection from a two-dimensional plane within the chip to a three-dimensional structure by extending wirings onto the substrate. This dimensional transition allows wider wiring paths without increasing chip footprint, thereby reducing resistance while maintaining miniaturization
2Reliability
If additional wiring is formed or wiring thickness is increased to reduce resistance, then wire resistance decreases, but production cost increases and yield deteriorates
Solution Approach 1:
The patent introduces substrate wirings as an intermediary element that provides low-resistance connection paths outside the chip. This mediator approach allows the chip itself to remain simple and easy to manufacture, while the substrate handles the complex low-resistance routing requirements
Data Source
AI summary
A semiconductor device includes a semiconductor chip which includes a first circuit and a second circuit that are spaced apart from each other, without internal wirings electrically connecting the first circuit and the second circuit to each other, a substrate on which the semiconductor chip is disposed, and substrate wirings that are arranged on the substrate and electrically connect the first circuit and the second circuit to each other.