Semiconductor Support Asymmetric Groove Gas Discharge
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor device production methods often result in voids in the bonding material between the semiconductor component and the mounting member due to insufficient removal of gases like volatile flux compounds, leading to reduced heat dissipation and reliability.
Innovation Solution
A semiconductor component support with a metal part featuring symmetrical pairs of openings, where one section is wider than the other, facilitating gas discharge and ensuring proper alignment and positioning of the semiconductor component during bonding, thereby preventing voids and enhancing the connection area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-generated harmful factors
If a straight groove with constant width is used, then gas can be discharged from the bonding material, but the semiconductor component experiences positional deviation or inclination
Solution Approach 1:
The groove is designed with asymmetric width variation, where the first section has a first width and the second section has a second width different from the first width. This asymmetric design allows the groove to effectively discharge gas while providing positioning surfaces that prevent semiconductor component deviation, resolving the contradiction between gas discharge capability and positioning accuracy
Solution Approach 2:
Different sections of the groove have different widths tailored to specific functions: the first section is optimized for gas discharge while the second section is optimized for positioning the semiconductor component. This local differentiation allows each section to perform its specific function effectively, simultaneously achieving both gas discharge and precise positioning
2Reliability
If bonding material is applied on the component-mounting portion, then the semiconductor component can be mounted, but voids appear in the bonding material due to trapped gas
Solution Approach 1:
The groove structure extracts gas from the bonding material by providing a dedicated discharge path. The groove extends from the surface to extract trapped gas bubbles during the bonding process, preventing void formation and ensuring reliable connection quality
Solution Approach 2:
The groove is pre-formed in the mounting member before bonding occurs, creating an advance gas escape route. This preliminary structure ensures that when bonding material is applied and heated, gas can be immediately discharged through the pre-positioned groove, preventing void formation
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
A semiconductor component support (20) is provided which includes a metal component support portion (31) for a semiconductor component (10) to be mounted on the semiconductor component support portion. The component support portion (31) includes a metal part (37) that includes an opening (35) in plan view. The opening of the metal part (37) includes a first section (351), and a second section (352). The second section (352) communicates with the first section (351), and is arranged outside the first section (351). The second section (352) is wider than the first section (351). The first section (351) can be at least partially positioned directly under a mount-side main surface of the semiconductor component (10).