Semiconductor Package Support Structure for Adhesive Bleeding Control
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Solution Overview
Problem
The challenge in semiconductor device packaging lies in controlling the bond line thickness (BLT) of adhesive materials, which is affected by manufacturing conditions and can lead to adhesive bleeding or flow into holes in the carrier, causing performance issues, and tilting of the semiconductor device due to misalignment of its center of gravity with the geometric center.
Innovation Solution
A semiconductor device package design featuring a substrate with a support structure and an adhesive, where the support structure's hardness is less than that of the electronic component, preventing adhesive flow and ensuring proper alignment and bonding through the use of polymeric or photosensitive materials for the support structure, which are easier to control and cost-effective to manufacture.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive material is applied to bond the semiconductor device to the carrier, then the bonding strength is improved, but the adhesive may bleed or flow into the hole to adversely affect the performance
Solution Approach 1:
A support structure is introduced as an intermediary element between the adhesive material and the hole in the carrier. This support structure prevents the adhesive from flowing into the hole while still allowing the adhesive to bond the semiconductor device to the carrier effectively.
Solution Approach 2:
The support structure is positioned in advance to counteract the potential harmful effect of adhesive bleeding into the hole. By having the support structure in place before adhesive application, the adhesive is prevented from entering the hole, thus eliminating the harmful effect before it can occur.
2Stability of the object's composition
If the semiconductor device is attached to the carrier, then the device is fixed in position, but the device may tilt due to misalignment of center of gravity with geometric center
Solution Approach 1:
The support structure serves as a mediator between the carrier and the semiconductor device, providing a stable platform that helps align the device's center of gravity with the geometric center of the carrier, preventing tilting while maintaining position stability.
3Object-generated harmful factors
If a rigid support structure is used to prevent adhesive flow, then the adhesive bleeding is prevented, but the manufacturing complexity and cost increase
Solution Approach 1:
The support structure's hardness is specifically controlled to be less than the hardness of the semiconductor device. This parameter change allows the support structure to be sufficiently rigid to prevent adhesive bleeding into the hole, while remaining soft enough to be easily manufactured and integrated without increasing manufacturing complexity or cost.
4Object-generated harmful factors
If the support structure hardness is increased to prevent adhesive flow, then the adhesive bleeding is prevented, but the support structure may damage the semiconductor device
Solution Approach 1:
The hardness of the support structure is precisely controlled to be less than the hardness of the semiconductor device. This parameter setting ensures that the support structure is sufficiently rigid to prevent adhesive from flowing into the hole, while simultaneously being soft enough to avoid damaging the semiconductor device during the bonding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively controls the BLT, prevents adhesive bleeding, ensures proper alignment and bonding, and reduces manufacturing complexity and cost by using polymeric or photosensitive materials for the support structure, enhancing the overall performance and reliability of the semiconductor device package.
Implementation Method 1
A semiconductor device package may include a semiconductor device which is attached or bonded to a carrier (a substrate, a leadframe or the like) by an adhesive material
Implementation Method 2
removing a portion of the photosensitive layer to form a support structure
Data Source
AI summary
The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.