3D Semiconductor Stacked Structure Support Body Leaning Prevention
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Solution Overview
Problem
The reliability of three-dimensional semiconductor devices is compromised due to the high aspect ratio of stacked structures, leading to manufacturing difficulties and potential leaning issues when forming slits to separate the stacked layers, which affects the integration and reliability of memory cells.
Innovation Solution
The semiconductor device incorporates a support body with holes formed between stacked groups, featuring alternately stacked interlayer insulating and conductive patterns separated by slits, preventing direct contact and leaning by interposing the support body, thereby enhancing reliability and simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the number of stacked memory cells is increased to improve integration, then the degree of integration is improved, but the aspect ratio of the stacked structure increases causing leaning and reliability issues
Solution Approach 1:
The stacked structure is divided into multiple stacked groups, each containing a subset of the total stacked memory cells. This segmentation reduces the aspect ratio of each individual stacked group, preventing leaning while maintaining high overall integration. The structure is further segmented by slits that separate adjacent stacked groups, providing additional structural support and stability.
Solution Approach 2:
Support bodies are introduced as intermediary structures between adjacent stacked groups. These support bodies fill the spaces between stacked groups and provide mechanical support, preventing leaning and enhancing the reliability of the overall stacked structure. The support bodies act as mediators that transfer and distribute mechanical loads, reducing stress on the stacked memory cells.
2Ease of manufacture
If slits are formed to separate the stacked structure for manufacturing, then the manufacturing process is enabled, but the stacked structure leans due to high aspect ratio
Solution Approach 1:
The structure is segmented into discrete stacked groups separated by slits, allowing independent handling and positioning of each group during manufacturing. This segmentation enables precise alignment of individual stacked groups while maintaining overall structural integrity through the support bodies that fill the spaces between groups.
Solution Approach 2:
Support bodies serve as intermediary structures that facilitate the positioning and alignment of stacked groups during manufacturing. By filling the spaces between stacked groups, they provide reference surfaces and mechanical constraints that ensure precise alignment while enabling the separation needed for manufacturing processes.
3Quantity of substance
If the stacked structure is made taller to increase integration, then the number of memory cells increases, but manufacturing becomes more difficult
Solution Approach 1:
Instead of manufacturing one tall stacked structure, the memory cells are distributed across multiple shorter stacked groups. Each group can be manufactured independently with standard aspect ratios, avoiding the manufacturing difficulties of tall structures. The groups are then assembled vertically to achieve the desired total integration density.
Solution Approach 2:
The structure transitions from a single vertical dimension of height to a multi-dimensional arrangement where stacked groups are distributed in both vertical and lateral dimensions. This dimensional redistribution allows manufacturing of manageable-sized groups while achieving high overall integration through spatial arrangement.
Data Source
AI summary
A semiconductor device includes stacked groups each including interlayer insulating patterns and conductive patterns and stacked in at least two tiers, wherein the insulating patterns and the conductive patterns are alternately stacked over a substrate and separated by slits, and a support body including holes and formed between the stacked groups.