Semiconductor Device Support Member Pressing Element Unit Toward Cooler
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Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently cooling element units while maintaining a compact size, as the fixation structure can lead to increased device size due to inefficient surface contact and complex assembly processes.
Innovation Solution
A semiconductor device configuration featuring a support member with a condenser housing chamber and a board fixing portion that presses the element unit toward the cooler, ensuring good surface contact and reducing the device's height dimension, while also housing the condenser with a parallel opposing surface to facilitate efficient thermal conduction and coolant flow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the element units are directly fixed to the bottom wall to improve cooling efficiency, then the cooling performance is improved, but the device size is likely to increase
Solution Approach 1:
The support member integrates multiple functions: it supports the condenser and control board, presses the element unit against the cooler for thermal contact, and provides structural stability. This consolidation of functions into a single component achieves effective cooling without increasing device volume.
Solution Approach 2:
The support member serves multiple purposes simultaneously: mechanical support for electrical components, thermal pressure application for cooling efficiency, and structural stabilization. This multi-functionality resolves the contradiction by achieving cooling performance without requiring additional space-increasing components.
2Temperature
If a complex fixation structure is used to ensure good surface contact, then the cooling efficiency is improved, but the device complexity increases
Solution Approach 1:
The support member combines the fixation function with the pressing function in a single integrated component. By merging these functions, the invention eliminates the need for separate fixation mechanisms, thereby reducing device complexity while maintaining effective thermal contact through the pressing action.
Solution Approach 2:
The support member performs multiple functions including fixation, pressing for thermal contact, and structural support. This multi-functional design simplifies the overall device structure by replacing what would otherwise require multiple separate components, thus reducing complexity while achieving good surface contact for cooling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient cooling of the element unit, reduces the device's height, and simplifies the assembly process by minimizing the number of parts and improving surface contact, thereby achieving both effective cooling and downsizing.
Implementation Method 1
The condenser housing chamber has a parallel opposing surface that is arranged in parallel with the element unit arrangement surface and faces the element unit arrangement surface... in a state where the parallel opposing surface presses the element unit toward the cooler
Data Source
AI summary
A semiconductor device configured to enable efficient cooling of an element and downsizing of the device. The semiconductor device including an element unit connected to a surface of a cooler. A support member that has a condenser housing chamber that houses the condenser. The condenser has two parallel planar surfaces that are parallel with each other. The condenser housing chamber has a parallel opposing surface that is arranged in parallel with the element unit arrangement surface and faces the element unit arrangement surface, and houses the condenser in a state where the two parallel planar surfaces are arranged in parallel with the parallel opposing surface. The support member is fixed to the cooler in a state where the parallel opposing surface presses the element unit toward the cooler.