Semiconductor Package Support Structure with Inclined Cavities

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Solution Overview

Problem

The increasing demand for higher-performance, higher-speed, and smaller electronic components in the semiconductor industry poses challenges in achieving structural stability and minimizing defects in semiconductor packages, particularly due to the thinness of integrated circuit chips and printed circuit boards.

Innovation Solution

A semiconductor package design featuring a package substrate with a support structure having a cavity and inclined surfaces, along with a method involving sacrificial structures, anisotropic etching, and a molding layer to enhance structural stability and reduce defects, including the use of a support layer to prevent substrate deformation during manufacturing processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the thickness of the integrated circuit chip and printed circuit board are reduced to achieve smaller electronic components, then the size of electronic components is reduced, but the structural stability of the semiconductor package deteriorates

Engineering Contradiction:

Improvesize of electronic componentsVSAvoidstructural stability

Core Design Contradiction:

Volume of moving objectVSStability of the object's composition

Solution Approach 1:

The support structure is formed in advance on the package substrate before the semiconductor chip is mounted. This preliminary structural reinforcement provides a stable foundation that compensates for the reduced thickness of the chip and substrate, preventing structural instability without increasing the final package size.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Instead of increasing thickness in the vertical dimension to improve stability, the invention introduces a support structure with cavities and inclined surfaces that provide mechanical reinforcement through horizontal and diagonal dimensions. This dimensional approach maintains compact size while achieving structural stability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If a support structure with vertical sidewalls is used, then the manufacturing process is simpler, but the molding process becomes difficult due to air gaps and defects

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidmolding quality

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The support structure incorporates inclined surfaces instead of purely vertical sidewalls. These angled surfaces eliminate sharp corners and vertical gaps that trap air during molding, allowing mold material to flow smoothly and fill the cavity completely. This curvature modification prevents voids and defects while maintaining manufacturing feasibility.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The support structure uses asymmetric inclined surfaces with specific angles rather than symmetric vertical walls. This asymmetric design optimizes material flow during molding while providing adequate structural support, resolving the conflict between manufacturing ease and molding precision.

Inventive Principle:

Principle #4Asymmetry

3Adaptability or versatility

If the spacing between the semiconductor chip and support structure is not constant, then the support structure can accommodate chip variations, but the molding process produces defects

Engineering Contradiction:

Improvechip accommodationVSAvoidmolding precision

Core Design Contradiction:

Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The support structure features localized inclined surfaces at specific regions where spacing variations occur, while maintaining constant spacing in critical molding areas. This local modification allows chip accommodation where needed without compromising overall molding quality.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The inclined surfaces create a gradual transition in spacing rather than abrupt changes, allowing mold material to flow smoothly throughout the cavity. This curved transition prevents air trapping and void formation even when accommodating chip variations.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution improves structural stability and reduces defects in semiconductor packages by maintaining consistent spacing between the semiconductor chip and the support structure, allowing for efficient molding and minimizing failure rates during the manufacturing process.

Implementation Method 1

performing an anisotropic etching process on the support layer to form recesses exposing top surfaces of the sacrificial structures

Methodology Applied

Scientific EffectAnisotropic etching:

Data Source

PatentUS11289430B2Semiconductor package and a method for manufacturing the same

Publication Date: 2022.03.29 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package may include a package substrate, a support structure on the package substrate and having a cavity therein, and at least one first semiconductor chip on the package substrate in the cavity. The support structure may have a first inner sidewall facing the cavity, a first top surface, and a first inclined surface connecting the first inner sidewall and the first top surface. The first inclined surface may be inclined with respect to a top surface of the at least one first semiconductor chip.