Semiconductor Device Support Part Wire Crossing
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Solution Overview
Problem
Existing semiconductor devices face challenges in size reduction and internal resistance due to the arrangement of transistors and wire connections, which affect the efficiency and compactness of the device.
Innovation Solution
The semiconductor device incorporates a support part with specific edge configurations and wire crossings to reduce size and internal resistance, featuring a normally-off transistor and a normally-on transistor in a cascode connection, with wires crossing support-part edges to minimize terminal arrangement and optimize conduction paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If transistors and wires are arranged in conventional configurations, then device functionality is maintained, but device size increases and internal resistance increases
Solution Approach 1:
The patent applies dimensionality change by having wires cross the second support-part edges in plan view, transitioning from a planar arrangement to a three-dimensional spatial configuration. This allows wires to pass over or under the support part edges, reducing wire length and internal resistance while maintaining electrical connectivity, thereby resolving the contradiction between device size reduction and internal resistance control
Solution Approach 2:
The support part features asymmetric edge configurations where two first support-part edges are parallel to a first direction and spaced apart in a second direction, while two second support-part edges physically connect the first edges. This asymmetric structure enables optimized wire routing paths that cross the second edges, allowing compact transistor arrangement and reduced device size without compromising electrical performance
2Area of stationary object
If transistors are arranged compactly to reduce device size, then device compactness improves, but wire routing complexity and internal resistance increase
Solution Approach 1:
By utilizing the third dimension through wire crossings over support-part edges, the patent simplifies wire routing in compact layouts. Wires can pass over edges rather than requiring complex lateral routing around transistors, reducing routing complexity while maintaining compact device area
Solution Approach 2:
The support part edges serve as intermediaries that facilitate wire routing in compact configurations. Wires crossing the second support-part edges use these edges as reference points and physical barriers that guide routing paths, simplifying the complexity of connecting compactly arranged transistors while maintaining short wire lengths
Data Source
AI summary
According to a first aspect of the present disclosure, a semiconductor device is provided. The semiconductor device includes a first transistor, a second transistor, at least one source terminal, at least one gate terminal, at least one drain terminal, a source wire, a gate wire, a drain wire and a support part. The support part includes two first support-part edges and two second support-part edges. Each of the two first support-part edges is parallel to a first direction, and the two first support-part edges are spaced apart from each other in a second direction that is perpendicular to the first direction. Each of the two second support-part edges is physically connected to the two first support-part edges. The source wire, the gate wire and the drain wire cross at least one of the two second support-part edges in plan view.