Semiconductor Package Supporting Posts for Warpage Control
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Solution Overview
Problem
The integration of multiple semiconductor devices in miniaturized electronic apparatus poses challenges due to the need for advanced packaging and assembling techniques that enhance electrical performance and reduce transmission and insertion losses.
Innovation Solution
A semiconductor package structure involving chips bonded to an interposer with through semiconductor vias and under-bump metallurgies, encapsulated with a molding compound, and connected to a circuit substrate with supporting posts and connective terminals, which are designed to withstand thermal and mechanical stresses and maintain electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor devices are integrated in miniaturized electronic apparatus, then device functionality and electrical performance are improved, but transmission loss and insertion loss increase
Solution Approach 1:
A support structure is introduced as an intermediary component between the circuit substrate and the assembly environment. This support structure provides mechanical stability and structural reinforcement, enabling reliable electrical connections while maintaining signal integrity and reducing transmission losses in miniaturized multi-device configurations
2Reliability
If advanced packaging and assembling techniques are used to enhance electrical performance, then device reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The packaging system is segmented into distinct functional components: a circuit substrate for electrical connections, a support structure for mechanical stability, and semiconductor devices for functionality. This segmentation allows each component to be optimized independently while simplifying the overall assembly process and manufacturing procedures
3Stability of the object's composition
If materials with higher melting points are used to resist deformation during assembly, then structural stability is improved, but processing temperature requirements increase
Solution Approach 1:
The support structure utilizes composite material characteristics by combining materials with complementary properties. The composite construction provides high structural stability and resistance to deformation during assembly processes while managing thermal requirements through material selection that balances melting point considerations with processing temperature constraints
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure enables efficient integration and reliable electrical connections, reducing warpage and enhancing the reliability of electronic devices by using materials with higher melting points to resist deformation during assembly processes.
Implementation Method 1
The supporting posts have a first melting temperature higher than a second melting temperature of the connective terminals
Data Source
AI summary
A semiconductor device includes a circuit substrate, a semiconductor package, connective terminals and supports. The circuit substrate has a first side and a second side opposite to the first side. The semiconductor package is connected to the first side of the circuit substrate. The connective terminals are located on the second side of the circuit substrate and are electrically connected to the semiconductor package via the circuit substrate. The supports are located on the second side of the circuit substrate beside the connective terminals. A material of the supports has a melting temperature higher than a melting temperature of the connective terminals.