Semiconductor Package Surface Profile Modifier for Heat Dissipation

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Solution Overview

Problem

High-density semiconductor packages face challenges in efficient heat dissipation and mechanical stability due to thermal expansion differences between components, leading to potential warpage and operational failures.

Innovation Solution

A semiconductor package design featuring a surface profile modifier with thermally conductive particles and heat transfer patterns on the IC device and mold surfaces, increasing the surface area for heat dissipation and adhesive contact, which includes forming a mold on the circuit board, applying thermally conductive particles, and using an adhesive member with a dissipating member to enhance thermal conductivity and mechanical stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If high-density semiconductor packages are manufactured with small size, then integration density is improved, but heat dissipation efficiency deteriorates

Engineering Contradiction:

Improveintegration densityVSAvoidheat dissipation efficiency

Core Design Contradiction:

ProductivityVSTemperature

Solution Approach 1:

The patent introduces a surface profile modifier that creates three-dimensional microstructures (protrusions and recesses) on the IC device surface. This transforms the originally flat two-dimensional surface into a three-dimensional textured surface, increasing the effective surface area for heat dissipation without increasing the package footprint, thus resolving the contradiction between small size and heat dissipation efficiency

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The surface profile modifier creates a porous-like microstructure with numerous protrusions and recesses on the IC device surface. This increased surface area provides more pathways for heat transfer and improves convective heat dissipation, enabling efficient thermal management in high-density packages while maintaining compact dimensions

Inventive Principle:

Principle #31Porous materials

2Temperature

If surface profile modifier is added to increase surface area, then heat dissipation is improved, but device complexity increases

Engineering Contradiction:

Improveheat dissipationVSAvoidstructure complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The surface profile modifier is formed on the IC device surface before the molding process. By pre-texturing the IC device surface with protrusions and recesses, the patent enables subsequent adhesive members and heat dissipating members to achieve better mechanical interlocking and thermal contact without requiring complex post-processing steps, thus improving heat dissipation while controlling overall device complexity

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The surface profile modifier acts as an intermediary structure between the IC device and the adhesive member/heat dissipating member. This intermediate textured surface enhances the interface properties, providing both mechanical anchoring through the protrusions/recesses and improved thermal contact, thereby achieving better heat dissipation without directly complicating the IC device itself

Inventive Principle:

Principle #24Intermediary (Mediator)

3Stability of the object's composition

If adhesive member covers the surface profile modifier, then mechanical stability is improved, but heat transfer efficiency may deteriorate

Engineering Contradiction:

Improvemechanical stabilityVSAvoidheat transfer efficiency

Core Design Contradiction:

Stability of the object's compositionVSTemperature

Solution Approach 1:

The adhesive member is selectively applied to cover only the recesses of the surface profile modifier, while the protrusions remain exposed. This localized coverage provides mechanical stability through adhesion in the recess areas while maintaining heat transfer efficiency through direct thermal contact of the exposed protrusions with the heat dissipating member, thus resolving the contradiction between mechanical stability and heat transfer efficiency

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively enhances heat dissipation and mechanical stability, preventing warpage and improving the reliability and performance of high-density semiconductor packages by increasing the surface area for thermal dissipation and adhesive contact.

Implementation Method 1

the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

dissipate heat

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 3

an adhesive member on the surface of the IC device and the surface of the mold to cover the surface profile modifier

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS9293389B2Method of manufacturing a semiconductor package including a surface profile modifier

Publication Date: 2016.03.22 SAMSUNG ELECTRONICS CO LTD

AI summary

A semiconductor package includes a circuit board having an inner circuit pattern and a plurality of contact pads connected to the inner circuit pattern, at least one integrated circuit (IC) device on the circuit board and making contact with the contact pads, a mold on the circuit board, the mold fixing the IC device to the circuit board, and a surface profile modifier on a surface of the IC device and a surface of the mold, and the surface profile modifier enlarging a surface area of the IC device and the mold to dissipate heat.