Semiconductor Support Surface Texture for Thermal Compound Leakage
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Solution Overview
Problem
Existing semiconductor devices face issues with thermal compound leakage due to thermal expansion mismatch between the metal layer and installation surfaces, such as water-cooling jackets or heat sinks, which can compromise the integrity of the interface.
Innovation Solution
The semiconductor device incorporates a first surface with an uneven region comprising a plurality of dot-shaped recesses formed by pulsed laser irradiation, arranged in specific patterns to prevent thermal compound leakage by evenly distributing contact pressure and enhancing surface engagement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat metal plate heat sink is used, then the device structure is simple and easy to manufacture, but thermal compound leakage occurs due to thermal expansion mismatch
Solution Approach 1:
The patent applies local quality by creating an uneven surface structure with recesses and protrusions on specific areas of the heat sink surface. This local structural modification allows different regions to serve different functions: the protrusions provide stable contact points while the recesses accommodate thermal expansion and prevent compound leakage, thereby resolving the contradiction between manufacturing simplicity and interface integrity.
Solution Approach 2:
The patent utilizes curvature by forming dot-shaped recesses with curved surfaces on the heat sink. These curved recesses better accommodate the thermal expansion behavior of the metal plate, allowing the surface to maintain reliable contact with the installation surface while preventing thermal compound leakage during thermal cycling.
2Reliability
If the metal plate surface is made uneven with recesses, then thermal compound leakage is prevented, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the heat sink surface into multiple discrete dot-shaped recesses arranged in a pattern rather than creating a continuously complex uneven surface. This segmented approach achieves the reliability benefit of preventing thermal compound leakage while keeping the manufacturing process relatively simple through repetitive, modular surface features.
3Ease of manufacture
If a simple metal plate is used, then manufacturing is easy, but thermal expansion causes contact instability during thermal cycling
Solution Approach 1:
The patent applies local quality by creating an uneven surface structure with recesses and protrusions on specific areas of the heat sink. This local structural modification allows different regions to serve different functions: the protrusions provide stable contact points while the recesses accommodate thermal expansion and prevent compound leakage, thereby resolving the contradiction between manufacturing simplicity and interface integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The uneven surface design effectively suppresses thermal compound leakage, ensuring reliable contact and stability between the semiconductor device and installation surfaces, even under thermal cycling conditions.
Implementation Method 1
the first surface includes an uneven region comprising a plurality of dot-shaped recesses overlapping with each other
Data Source
AI summary
A semiconductor device includes a support, a first semiconductor element and a second semiconductor element that are disposed on a first side in a thickness direction of the support, and a sealing body covering a part of the support and the first and the second semiconductor elements. The support includes a first surface facing a second side in the thickness direction and exposed from the sealing body, and the first surface includes an uneven region comprising a plurality of dot-shaped recesses overlapping with each other.