Semiconductor Device With Surface Waveguides for Signal Transmission
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Solution Overview
Problem
Conventional semiconductor devices face challenges with high signal transmission loss, noise, and increased fabrication complexity due to the use of optical fibers embedded in printed circuit boards, which hinder the development of high-density, lightweight, and cost-effective optoelectronic components.
Innovation Solution
A semiconductor device with optoelectronic components is designed, featuring a carrier board with openings for optoelectronic components, a dielectric layer exposing electrode and optical active areas, and a circuit layer connected via conductive structures, along with surface-mounted waveguides that reduce signal transmission loss and noise, simplify fabrication, and enhance wiring density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical fibers are embedded in printed circuit boards using conventional methods, then signal transmission quality is improved, but fabrication complexity and cost increase due to grooving and manual placement requirements
Solution Approach 1:
The patent replaces the mechanical embedding process of optical fibers (requiring grooves and manual placement) with a printed circuit board structure that integrates optical waveguides directly into the board layers. This substitution eliminates the need for separate mechanical embedding steps, reducing fabrication complexity while maintaining signal transmission quality.
Solution Approach 2:
The patent merges the optical waveguide structure with the printed circuit board structure by forming waveguides within the same substrate layers and routing structures. This integration combines what were previously separate components (optical fiber embedding and PCB fabrication) into a unified manufacturing process, reducing overall fabrication complexity.
2Speed
If optical fibers are embedded in printed circuit boards, then high-speed signal transmission is achieved, but the device weight increases
Solution Approach 1:
The patent changes the physical parameters of the transmission medium by using planar optical waveguides formed in thin PCB layers instead of traditional cylindrical optical fibers. This parameter change reduces the material volume and weight while maintaining the optical transmission properties necessary for high-speed signal transmission.
3Power
If copper circuits are used for data transmission, then electrical signal transmission is achieved, but signal transmission loss and electromagnetic interference increase at high frequencies
Solution Approach 1:
The patent substitutes electrical signal transmission through copper circuits with optical signal transmission through waveguides. This replacement eliminates the electromagnetic interference and signal loss inherent in copper circuits at high frequencies, as optical signals are not susceptible to electromagnetic interference and experience lower attenuation.
4Reliability
If protective structures are added to prevent electromagnetic interference in metallic circuits, then signal transmission reliability is improved, but design and fabrication cost increase
Solution Approach 1:
The patent replaces the need for protective shielding structures around metallic circuits with intrinsic optical waveguide structures. Since optical signals are naturally immune to electromagnetic interference, the complex protective structures required for electrical circuits become unnecessary, reducing both design and fabrication costs while maintaining or improving signal transmission reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces signal transmission loss and noise, simplifies fabrication processes, and increases the density of circuit wiring, enabling more efficient and cost-effective production of high-performance optoelectronic components.
Implementation Method 1
at least one waveguide is formed on the surface of the insulating layer, and the transmission terminal of the waveguide has a reflection surface
Implementation Method 2
the transmission terminal of the waveguide has a reflection surface
Data Source
AI summary
A semiconductor device integrated with optoelectronic components includes a carrier board with at least two openings; a first and a second optoelectronic component disposed in the openings respectively, each of them having an active surface and an opposite non-active surface, wherein the active surface has a plurality of electrode pads and an optical active area; a dielectric layer formed on a surface of the carrier board and the active surfaces, and having a plurality of vias and openings to expose the electrode pads and the optical active areas respectively; and a circuit layer formed on a surface of the dielectric layer and electrically connected to the electrode pads directly. Then, at least one waveguide is formed on the surface of the semiconductor device integrated with the optoelectronic component to provide signal transmitting between the first and second optoelectronic components, therefore, shortens the signal transmission path, reduces the transmission loss and noise, and hence improves the signal transmission quality.