Multi-Layer Semiconductor Package Integrating Surge Protection

Solution Overview

Problem

Existing electronic products require multiple discrete elements for various functions, leading to increased cost and space usage due to the inability to integrate multiple functions into a single component, such as solid state diodes for surge protection.

Innovation Solution

A multi-layer semiconductor element package structure is developed, comprising a substrate unit with multiple layers, one-way conduction elements, and protection elements, where one-way conduction elements are enclosed by a first insulated layer and protection elements with anti-surge functions are enclosed by a second insulated layer, allowing for efficient integration of surge protection functions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple discrete elements are used for different protection functions, then the protection coverage is improved, but the space occupation and cost increase

Engineering Contradiction:

Improveprotection coverageVSAvoidspace occupation

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent combines multiple discrete protection elements (rectifying diodes and surge protection elements) into a single integrated package structure. The package includes a substrate with multiple receiving spaces that accommodate different types of protection elements, allowing them to be mounted and wired as a single unit rather than separate components.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integrated package structure serves multiple protection functions simultaneously within a single component. The substrate is designed with multiple receiving spaces that can accommodate different types of protection elements (rectifying diodes, surge protection elements), enabling the single package to provide both rectification and surge protection functions.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If multiple discrete elements are used for different protection functions, then the protection coverage is improved, but the manufacturing cost increases

Engineering Contradiction:

Improveprotection coverageVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent combines multiple discrete protection elements (rectifying diodes and surge protection elements) into a single integrated package structure. The package includes a substrate with multiple receiving spaces that accommodate different types of protection elements, allowing them to be mounted and wired as a single unit rather than separate components.

Inventive Principle:

Principle #5Merging (Combining)

3Reliability

If multiple discrete elements are used for different protection functions, then the protection coverage is improved, but the device complexity increases

Engineering Contradiction:

Improveprotection coverageVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines multiple discrete protection elements (rectifying diodes and surge protection elements) into a single integrated package structure. The package includes a substrate with multiple receiving spaces that accommodate different types of protection elements, allowing them to be mounted and wired as a single unit rather than separate components.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution creates multiple receiving spaces for discrete elements, enabling the integration of surge protection functions within a compact structure, reducing cost and space requirements while maintaining effective functionality.

Implementation Method 1

The one-way conduction unit has a plurality of one-way conduction elements electrically disposed between the at least one top substrate and the at least one middle substrate

Methodology Applied

Scientific EffectOne-way conduction: Diode

Implementation Method 2

The protection unit has at least one protection element with anti surge current or anti surge voltage function electrically disposed between the at least one middle substrate and the at least one bottom substrate

Methodology Applied

Scientific EffectSurge protection:

Data Source

PatentUS8520403B2Multi-layer semiconductor element package structure with surge protection function

Publication Date: 2013.08.27 ZOWIE TECH CORP

AI summary

A multi-layer semiconductor element package structure with surge protection function includes a substrate unit, an insulated unit, a one-way conduction unit and a protection unit. The substrate unit has at least one top substrate, at least one middle substrate and at least one bottom substrate. The insulated unit has at least one first insulated layer filled between the top substrate and the middle substrate and at least one second insulated layer filled between the middle substrate and the bottom substrate. The one-way conduction unit has a plurality of one-way conduction elements electrically disposed between the top substrate and the middle substrate and enclosed by the first insulated layer. The protection unit has at least one protection element with anti surge current or anti surge voltage function electrically disposed between the middle substrate and the bottom substrate and enclosed by the second insulated layer.