Semiconductor Device Multi-Terminal Coupling Test Switch Circuit

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Solution Overview

Problem

Current semiconductor device testing methods, such as the small-number-terminal test and all-terminal test, face limitations in increasing the number of simultaneous measurements due to resource constraints, leading to higher test costs and difficulties in applying multi-terminal coupling tests to wafer testing processes.

Innovation Solution

Incorporating a switch circuit and switch control circuit within the semiconductor device to enable a device multi-terminal coupling test, which allows for increased simultaneous measurements without the need for extensive relay mounting on test boards, enabling the test to be applied to both final and wafer test processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an all-terminal test is performed using all external terminals connected to the external inspection device, then complete testing coverage is achieved, but the number of simultaneous measurements cannot be increased due to resource constraints

Engineering Contradiction:
Improvetesting coverageVSAvoidnumber of simultaneous measurements
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent divides the testing function by separating the switching control from the external inspection device and embedding it within the semiconductor device itself. The switch circuit segments the connection paths between external terminals and internal circuits, allowing one external terminal to be dynamically connected to different internal circuits under test. This segmentation enables multiple internal circuits to share a single external terminal connection, thereby increasing the number of simultaneous measurements while maintaining complete testing coverage.

Inventive Principle:
Principle #1Segmentation

2Productivity

If a small-number-terminal test is performed using limited external terminals, then the number of simultaneous measurements can be increased, but certain test items cannot be realized

Engineering Contradiction:
Improvenumber of simultaneous measurementsVSAvoidtest item coverage
Core Design Contradiction:
ProductivityVSAdaptability or versatility

Solution Approach 1:

The patent implements dynamic switching capability within the semiconductor device that allows the connection configuration to change during testing. The switch control circuit dynamically reconfigures which internal circuit is connected to the external terminal based on the current test requirements. This dynamic adaptability enables the system to perform different test items (including all-terminal tests) while maintaining a limited number of external terminal connections, thus increasing simultaneous measurements without sacrificing test item coverage.

Inventive Principle:
Principle #15Dynamics

3Adaptability or versatility

If extensive relay mounting is performed on test boards to enable multi-terminal coupling tests, then test flexibility is improved, but component and development costs increase

Engineering Contradiction:
Improvetest flexibilityVSAvoidcomponent and development costs
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent extracts the switching control function from the external test board environment and embeds it directly within the semiconductor device. By taking out the relay mounting requirement from the test board and replacing it with an internal switch circuit controlled by a switch control circuit, the system achieves the same test flexibility without the need for extensive external relay mounting. This extraction eliminates the associated component costs and development complexities while maintaining test adaptability.

Inventive Principle:
Principle #2Taking out (Extraction)

4Productivity

If relay mounting is required on test boards for multi-terminal coupling tests, then device complexity increases, but the test can be applied to final and wafer test processes

Engineering Contradiction:
Improveapplicability to test processesVSAvoidtest board complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The patent enables the semiconductor device to perform its own internal switching and connection management during testing. The switch control circuit, integrated within the device, automatically manages the connection configuration between external terminals and internal circuits without requiring external relay control. This self-service capability allows the device to be tested in both final and wafer test processes using a simplified test board configuration, thereby reducing test board complexity while maintaining broad process applicability.

Inventive Principle:
Principle #25Self-service

Data Source

PatentUS20240310427A1Semiconductor device and method of manufacturing the same
Publication Date: 2024.09.19 RENESAS ELECTRONICS CORP
  • US20240310427A1 patent drawing
  • US20240310427A1 patent drawing
  • US20240310427A1 patent drawing

AI summary

A switch circuit connects an external inspection device to a first internal circuit, a second internal circuit, or both the first internal circuit and the second internal circuit in a state where the external inspection device is connected to an external terminal. A switch control circuit selects a connection destination of the external inspection device in the switch circuit based on a test setting signal from outside.