Semiconductor Switch Circuit for Wire Sweep Prevention
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Solution Overview
Problem
The manufacturing yield and cost of semiconductor devices are hindered by wire sweep issues during the resin sealing process, particularly when using common semiconductor chips for various package types, leading to reduced yield and increased costs due to short circuits and deformation of wires.
Innovation Solution
Incorporating a switch circuit unit in the semiconductor chip that can be set to either enable or disable signal transmission between internal and external circuits, allowing for the use of invalid pads during resin sealing, and connecting an additional wire to invalid pads to decelerate the resin flow and prevent wire deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple package types are produced using common semiconductor chips, then manufacturing flexibility and cost-effectiveness are improved, but wire sweep issues during resin sealing increase leading to reduced manufacturing yield
Solution Approach 1:
The patent applies preliminary action by pre-setting the switch circuit unit to a specific state (first or second state) before the resin sealing process. This predetermined configuration allows the wire bonding pattern to be optimized in advance for each package type, preventing wire sweep during sealing without requiring physical modifications to the chip or lead frame structure.
Solution Approach 2:
The patent implements dynamics by making the electrical connection configuration changeable through the switch circuit unit, which can be set to different states depending on the package type. This dynamic reconfiguration capability allows the same chip to adapt to different package requirements (e.g., different numbers of external terminals) while maintaining optimal wire bonding patterns for each configuration, thereby preventing wire sweep issues.
2Reliability
If additional wires are connected to invalid pads to control resin flow, then wire sweep is prevented, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent applies preliminary action by pre-configuring the switch circuit unit to establish appropriate electrical connections before resin sealing begins. This advance preparation ensures that wires are only bonded to pads that will remain electrically functional in the final package configuration, eliminating the need for additional wires to control resin flow and avoiding unnecessary complexity in the wire bonding process.
Data Source
AI summary
A semiconductor device PKG includes a semiconductor chip CP, a lead LD3, a wire BW5 electrically connecting a pad electrode PD2 of the semiconductor chip CP to the lead LD3, a wire BW3 electrically connecting a pad electrode PD3 of the semiconductor chip CP to the lead LD3, and a sealing body sealing them with a resin. The semiconductor chip CP includes internal circuits 5b and 5c, and a switch circuit unit SW. Signal transmission is possible between the internal circuit 5c and the pad electrode PD3. The switch circuit unit SW is a circuit capable of being set in a first state in which signal transmission is possible between the internal circuit 5b and the pad electrode PD2, and in a second state in which signal transmission is not possible between the internal circuit 5b and the pad electrode PD2. The switch circuit unit SW is fixed to the second state during operation of the semiconductor device PKG.