Semiconductor Switching Module Using Diffusion Solder Layers
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Solution Overview
Problem
The existing semiconductor switching modules using paste-solder bonding process face reliability issues due to short-circuits between small-area and large-area electrodes when employing flip-chip technology, necessitating thick bonding tape and wire connections, which complicates the production of multi-chip modules for on-board electrical supply systems.
Innovation Solution
The implementation of diffusion solder layers for flip-chip technology connections between semiconductor circuit chips and contact pads on a common circuit structure, allowing large-area drain electrodes to be connected without short-circuits, and using a ceramic circuit carrier with embedded copper plates for high current handling and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If paste-solder bonding process is used for flip-chip technology, then small-area electrodes can be connected, but short-circuits occur between small-area and large-area electrodes
Solution Approach 1:
The patent divides the bonding process into two distinct stages: first bonding large-area electrodes using paste-solder, then bonding small-area electrodes using wire bonding. This segmentation prevents short-circuits by ensuring large-area electrodes are securely connected before attempting small-area connections, eliminating the interference problem that causes reliability issues.
Solution Approach 2:
The patent performs preliminary bonding of large-area electrodes using paste-solder before proceeding to bond small-area electrodes. This preliminary action establishes a stable foundation and prevents short-circuits during subsequent small-area electrode bonding, as the large-area electrodes are already secured and isolated.
2Reliability
If thick bonding tape and wire connections are used to prevent short-circuits, then reliability improves, but device complexity increases
Solution Approach 1:
The patent extracts the problematic thick bonding tape from the design by using thin bonding tape instead. The segmentation of bonding processes allows thin tape to be used without compromising reliability, as the bonding sequence prevents short-circuits without requiring excessive tape thickness for isolation.
Solution Approach 2:
The patent introduces a ceramic substrate as an intermediary between electrodes. The ceramic material provides natural electrical isolation, allowing thin bonding tape to be used while maintaining reliability. The ceramic substrate acts as a mediator that prevents short-circuits through its inherent insulating properties rather than relying on thick bonding tape.
3Adaptability or versatility
If drain-down mounting is used with paste-solder bonding, then large-area external contacts can be connected, but flip-chip technology with multiple small-area electrodes cannot be implemented
Solution Approach 1:
The patent merges drain-down mounting and flip-chip technology into a hybrid approach. Large-area electrodes are connected using drain-down mounting with paste-solder, while small-area electrodes are connected using flip-chip technology with wire bonding. This combination allows both mounting technologies to coexist on the same module without compromising reliability.
Solution Approach 2:
The patent applies different bonding methods to different regions of the semiconductor chip: paste-solder bonding for large-area drain electrodes and wire bonding for small-area gates and sources. This local differentiation allows each electrode type to be bonded with the most appropriate method, enabling both drain-down and flip-chip technologies to be implemented simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures reliable semiconductor switching modules with minimized high-current bonding connections, preventing short-circuits and enhancing the reliability of motor bridge circuits in on-board electrical supply systems by using diffusion solder layers and a ceramic circuit carrier for efficient heat dissipation and high current handling.
Implementation Method 1
at least one of the semiconductor circuit chips is arranged on contact pads of the circuit structure using flip-chip technology and is electrically and cohesively connected to the contact pads by using diffusion solder layers
Implementation Method 2
using a ceramic circuit carrier with embedded copper plates for high current handling
Implementation Method 3
enhancing the reliability of motor bridge circuits in on-board electrical supply systems by using diffusion solder layers and a ceramic circuit carrier for efficient heat dissipation and high current handling
Data Source
AI summary
The invention relates to a semiconductor switching module for on-board electrical supply systems comprising a plurality of semiconductor chips, and a method for producing the same. The semiconductor switching module has at least one half-bridge circuit comprising a first semiconductor circuit chip as LSS (low side switch) and a second semiconductor circuit chip as HSS (high side switch) on a common circuit structure. The circuit structure includes contact pads on the top side of the circuit structure and lead connections with external contact areas on the underside of the circuit structure and with internal contact areas on the top side of the circuit structure. In this case, at least one of the semiconductor circuit chips is arranged on contact pads of the circuit structure using flip-chip technology and is electrically and cohesively connected to the contact pads by using diffusion solder layers.