Semiconductor Switching Device Spring Washer Clamping

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Solution Overview

Problem

Existing semiconductor switching devices face challenges in easy mounting, cost-effectiveness, and reliability due to complex spring systems and potential tilting issues during installation, which can lead to poor electrical connections.

Innovation Solution

A semi-fabricated semiconductor switching device utilizing a simple and low-cost spring washer with deflection elements that equalize height differences and provide a reliable electrical connection, allowing for easy mounting and modular construction without the need for sophisticated spring systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a complex spring system with Belleville springs is used to clamp the semiconductor element, then reliable electrical connection is achieved, but device complexity and manufacturing cost increase

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidspring system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent replaces expensive, complex Belleville springs with a simple, inexpensive spring washer that can be easily manufactured and replaced. The spring washer serves the same clamping function but with significantly reduced complexity and cost, aligning with the principle of using cheap, simple components to achieve the desired function without unnecessary complexity.

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The patent extracts the essential function of the spring system (providing clamping force) from its complex implementation (Belleville springs with multiple components) and implements it with a single, simple spring washer. This separates the core function from the complex structure, achieving reliability through functional simplicity rather than mechanical complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

2Force

If multiple tension screws are used to mount the semiconductor element, then clamping force is achieved, but mounting time and risk of tilting increase

Engineering Contradiction:
Improveclamping forceVSAvoidmounting time
Core Design Contradiction:
ForceVSLoss of time

Solution Approach 1:

The patent merges the functions of multiple tension screws into a single spring washer that provides uniform clamping force around the semiconductor element. This consolidation reduces the number of mounting operations from multiple screw tightenings to a single spring washer installation, significantly reducing mounting time while eliminating the risk of tilting associated with uneven screw tightening.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The spring washer automatically provides the necessary clamping force through its elastic deformation, eliminating the need for manual adjustment and tightening operations. The component self-regulates the clamping force, reducing mounting time and ensuring uniform pressure distribution without requiring precise manual intervention.

Inventive Principle:
Principle #25Self-service

3Device complexity

If a non-modular design with direct mounting on base plate is used, then structural simplicity is achieved, but adaptability and semi-fabrication capability are reduced

Engineering Contradiction:
Improvestructural simplicityVSAvoidmodular design capability
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The patent segments the mounting system into a removable spring washer component that can be independently manufactured and assembled. This segmentation enables modular construction where the spring washer acts as a separate, replaceable element, allowing for semi-fabrication and easy adaptation to different configurations while maintaining structural simplicity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The spring washer serves multiple functions: providing clamping force, ensuring electrical contact, and enabling modular assembly. This multi-functionality allows the same simple component to support both structural simplicity and modular design capabilities, achieving adaptability without increasing complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables cost-effective, reliable, and easy mounting of semiconductor switching devices with a spring washer system that ensures consistent electrical contact and reduces the risk of tilting, enhancing the overall efficiency and stability of the device.

Implementation Method 1

a spring system laterally surrounding the semiconductor element for clamping the semiconductor element between the cathode pole piece and anode pole piece

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentEP3571715B1Semiconductor switching device
Publication Date: 2021.03.03 HITACHI ENERGY SWITZERLAND AG
  • EP3571715B1 patent drawingFigure 1~4
  • EP3571715B1 patent drawingFigure 5~7
  • EP3571715B1 patent drawingFigure 8~10

AI summary

The invention relates to a semi-fabricated switching device comprising a semiconductor element (1) and a housing (2) comprising a spring system with a ring-shaped washer (6) laterally surrounding the semiconductor element (1) for clamping the semiconductor element (1) between two pole pieces (3, 4). The washer (6) is deflectable between the pole pieces by a first deflection element (7), which contacts the washer (6) in a first contact area (61) on a first side (60), and by a second deflection element (8), which contacts the washer (6) in a second contact area (63) on a second side (62). The first contact area (61) is displaced to the second contact area (63). The first and second deflection element (7, 8) can deflect the washer (6) such that in clamped condition an electrical contact is achievable between the pole pieces and the semiconductor element (1).