Semiconductor Tank Pressure Control for Etching Accuracy
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Solution Overview
Problem
In single wafer substrate processing devices, fluctuations in atmospheric pressure from the common exhaust pipe affect the accuracy of chemical solution concentration measurement, leading to variations in etching processes and reduced productivity.
Innovation Solution
A semiconductor manufacturing device with a tank pressure control unit that includes a pressure sensor and a variable opening valve to maintain constant atmospheric pressure inside the chemical solution preparation tank, ensuring accurate concentration measurement and control of the chemical solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the chemical solution preparation tank is connected to the common exhaust pipe for atmospheric pressure equalization, then the device structure is simplified and ease of operation is improved, but the atmospheric pressure inside the tank fluctuates causing measurement precision deterioration
Solution Approach 1:
The system is segmented into two separate pressure control paths: one path connects the chemical solution preparation tank to the common exhaust pipe for general pressure equalization, while another path introduces fresh atmospheric pressure through a dedicated opening. This segmentation allows the tank to benefit from simplified structure while maintaining stable pressure for accurate concentration measurements.
2Device complexity
If atmospheric pressure inside the chemical solution preparation tank fluctuates, then device complexity is reduced, but manufacturing precision deteriorates due to variations in etching rate and selectivity
Solution Approach 1:
A pressure control mechanism acts as an intermediary between the common exhaust pipe and the chemical solution preparation tank. This intermediary stabilizes the atmospheric pressure inside the tank by regulating the pressure equalization process, ensuring that concentration measurements and subsequent etching processes maintain high precision without significantly increasing device complexity.
3Measurement precision
If constant atmospheric pressure is maintained inside the chemical solution preparation tank using a pressure control unit, then measurement precision and manufacturing precision are improved, but device complexity increases
Solution Approach 1:
The system changes the pressure parameter by introducing a dedicated atmospheric pressure opening that maintains constant pressure inside the chemical solution preparation tank. This parameter change enables accurate concentration measurements and consistent etching processes, with the added complexity being justified by the significant improvement in measurement and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution maintains high accuracy in detecting the chemical solution concentration, allowing for precise adjustment and maintaining the etching rate and selectivity, thereby enhancing productivity and process consistency.
Implementation Method 1
a pressure sensor configured to measure a pressure inside the chemical solution preparation tank
Implementation Method 2
a variable opening valve arranged between the chemical solution preparation tank and an exhaust pipe
Data Source
AI summary
According to one embodiment, a semiconductor manufacturing device includes a chemical solution preparation tank configured to prepare a solution; a chamber configured to discharge the chemical solution prepared at the chemical solution preparation tank to a substrate; a pressure sensor configured to measure a pressure inside the chemical solution preparation tank; and a variable opening valve arranged between the chemical solution preparation tank and an exhaust pipe.