Semiconductor Removing Apparatus Tape Pulling Mechanism
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Solution Overview
Problem
The existing methods for removing diced silicon caps from semiconductor structures using air spray guns are time-consuming, pose a risk of injury to operators, and create dust in the working environment.
Innovation Solution
A semiconductor removing apparatus and method utilizing a stage, tape roll, clamp assembly, cutting tool, and motorized components to attach and detach a tape from the silicon cap, allowing for controlled separation of the diced portion without the need for air spray guns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If an air spray gun is used to blow out the diced portion of the silicon cap, then the removal process can be performed, but it is time-consuming and poses a risk of injury to the operator
Solution Approach 1:
The patent replaces the pneumatic air spray gun system with a mechanical tape pulling system. A tape is attached to the diced portion of the silicon cap, and a pulling device mechanically pulls the tape to remove the diced portion. This substitution eliminates the need for high-velocity air blasts that pose injury risks while maintaining efficient removal capability through controlled mechanical force.
Solution Approach 2:
The patent introduces a tape as an intermediary element between the pulling device and the diced silicon cap. The tape serves as a mediator that transfers the pulling force from the device to the diced portion, enabling controlled removal without direct contact between the operator/device and the cap, thereby eliminating injury risks associated with air spray while maintaining removal efficiency.
2Productivity
If an air spray gun is used to blow out the diced portion of the silicon cap, then the removal process can be performed, but it causes dust particles in the working environment
Solution Approach 1:
The patent replaces the air spray gun's pneumatic system with a mechanical tape pulling system. By using controlled mechanical force to pull the tape and attached diced portion, the system eliminates the high-velocity air flow that generates dust particles, thereby maintaining removal capability while preventing dust contamination in the working environment.
3Ease of operation
If a manual air spray gun operation is used, then the diced portion can be removed, but it is difficult for the operator to save time on the removal process
Solution Approach 1:
The patent implements an automated tape pulling system that performs the removal operation without requiring manual air spray gun operation. The system automatically attaches the tape to the diced portion and pulls it away, making the process self-executing and eliminating the time-consuming manual operation while maintaining ease of use through simple device operation.
Solution Approach 2:
The patent enables continuous removal operations by using a reusable tape and automated pulling mechanism. Once the device is set up, it can continuously pull tapes to remove diced portions from multiple caps without the interruptions and time losses associated with manual air spray gun repositioning and operation, thereby maintaining ease of operation while significantly reducing total removal time.
Data Source
AI summary
An operation method of a semiconductor removing apparatus includes moving a semiconductor structure to a stage, wherein the semiconductor structure includes a lower substrate, a cap, and a micro electro mechanical system (MEMS) structure between the lower substrate and the cap, and the cap has a diced portion; pulling, by a clamp assembly, a tape of a tape roll from a first side of the stage to a second side of the stage opposite to the first side, such that the tape is attached to the cap of the semiconductor structure; and pulling, by the clamp assembly, the tape of the tape roll from the second side of the stage back to the first side of the stage, such that the diced portion of the cap separates from the semiconductor structure.