Tapered Fitting Structure for Semiconductor Device Assembly
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Solution Overview
Problem
Conventional semiconductor device designs with perpendicular convex and concave portions face issues with positional deviation, requiring large forces for fitting or failing to fit when dimension margins are large, and necessitating excessive force when margins are small.
Innovation Solution
The semiconductor device incorporates tapered convex and concave portions on the base plate and case surfaces, allowing for appropriate fitting by guiding the portions to their correct positions, reducing positional deviation and assembly errors, and facilitating efficient assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If perpendicular convex and concave portions are used for fitting, then the structure is simple, but positional deviation is large when dimension margin is large and excessive force is needed when margin is small
Solution Approach 1:
The patent applies curvature by changing the fitting surfaces from perpendicular flat surfaces to tapered surfaces with inclined sides. The convex portion has tapered sides that guide the concave portion during assembly, creating a self-aligning mechanism that reduces positional deviation while maintaining structural simplicity.
Solution Approach 2:
The patent changes the geometric parameters of the fitting portions by introducing taper angles to the convex and concave portions. This parameter modification transforms the fitting mechanism from force-dependent perpendicular insertion to angle-guided tapered insertion, improving positional accuracy without increasing complexity.
2Ease of operation
If large dimension margin is used for convex and concave portions, then assembly is easier, but positional deviation increases
Solution Approach 1:
The tapered geometry with inclined surfaces creates a funnel-like guiding effect that naturally directs the convex portion into the correct position during assembly. This curved/tapered approach maintains ease of assembly while constraining positional deviation, resolving the trade-off between assembly ease and precision.
3Manufacturing precision
If small dimension margin is used for convex and concave portions, then positional accuracy improves, but excessive force is required for fitting
Solution Approach 1:
The tapered surfaces distribute the assembly force along the inclined planes rather than concentrating it at a single perpendicular interface. This geometric transformation reduces the peak force required while maintaining precise positioning, as the taper guides the parts into alignment during the fitting process.
Data Source
AI summary
It is an object to provide a technique capable of performing appropriate fitting in a base plate and a case. A semiconductor device includes: a semiconductor element, an insulating substrate on which the semiconductor element is mounted; a base plate on which the insulating substrate is mounted; and a case mounted on the base plate to surround the semiconductor element and the insulating substrate. One or more convex portions each having a tapered shape are provided in one of a surface of the base plate and a surface of the case, and one or more concave portions each having a tapered shape to be fitted to the one or more convex portions are provided in the other one of the surface of the base plate and the surface of the case.