Semiconductor Temperature Control via Correction Signal

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Semiconductor devices face challenges in accurately controlling temperature characteristics due to incorrect temperature detection by sensors, especially in stacked structures where heat from one chip is misinterpreted by sensors on adjacent chips, leading to inefficient refresh cycles and potential data loss.

Innovation Solution

A temperature control device is introduced, comprising a temperature reception circuit, a temperature correction circuit, and a temperature characteristics controller, which receives temperature signals from multiple chips and generates a correction temperature signal to adjust refresh cycles based on the highest temperature, ensuring accurate temperature characterization and frequent refresh operations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If a temperature sensor is installed on each chip to detect temperature, then temperature detection capability is improved, but measurement precision deteriorates due to heat interference from adjacent chips

Engineering Contradiction:
Improvetemperature detection accuracyVSAvoidheat interference from adjacent chips
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a temperature correction circuit as an intermediary component that receives temperature signals from multiple chips, identifies the highest temperature, and generates a corrected temperature signal. This mediator resolves the measurement interference by selecting the most accurate temperature reading among multiple sensors affected by thermal crosstalk.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The temperature correction circuit implements a feedback mechanism where temperature signals from all chips are continuously monitored, compared, and used to generate a corrected temperature signal that feeds back to the memory controller. This feedback loop ensures that temperature control decisions are based on the most reliable temperature data available.

Inventive Principle:
Principle #23Feedback

2Productivity

If refresh cycles are extended to improve write speed, then productivity is improved, but reliability deteriorates due to charge loss from insufficient refresh operations

Engineering Contradiction:
Improvewrite speedVSAvoiddata retention
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent implements dynamic refresh cycle adjustment where the refresh timing is adaptively changed based on real-time temperature conditions. When high temperature is detected, refresh cycles are shortened to prevent charge loss; when temperature is low, refresh cycles can be extended to improve write speed. This dynamic adaptation resolves the contradiction between productivity and reliability.

Inventive Principle:
Principle #15Dynamics

Data Source

PatentUS10032687B2Temperature control device, semiconductor device including the same, and method for controlling the semiconductor device
Publication Date: 2018.07.24 SK HYNIX INC
  • US10032687B2 patent drawing
  • US10032687B2 patent drawing
  • US10032687B2 patent drawing

AI summary

A temperature control device for controlling a temperature of a semiconductor device including a first chip and a second chip. The temperature control device may be configured to generate a correction temperature based on internal temperatures of the semiconductor device.