Semiconductor Temperature Measurement via Conductive Line Resistance
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Solution Overview
Problem
Semiconductor devices face challenges in accurately measuring temperature due to self-heating effects, especially in 3D structures where heat dissipation is limited, leading to imprecise temperature measurements with conventional sensors that are distant from the measurement site.
Innovation Solution
The solution involves connecting an electrode for temperature measurement directly to conductive lines on a semiconductor substrate, using a multipoint probe like a 4-point probe to measure resistance and calculate temperature based on the temperature coefficient of resistance (TCR), allowing for precise temperature measurement close to the measurement site.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If an additional temperature sensor is installed within the semiconductor device, then temperature measurement capability is provided, but the measurement position is relatively far from the actual temperature source, resulting in imprecise temperature measurements
Solution Approach 1:
The temperature measurement function is merged with the existing conductive lines (gate lines, word lines, bit lines) of the semiconductor device. The electrode for temperature measurement is connected directly to these conductive lines, allowing temperature measurement at the actual location where heat is generated, eliminating the need for separate distant temperature sensors.
Solution Approach 2:
The conductive lines serve as an intermediary between the heat-generating elements and the temperature measurement electrode. By measuring the resistance change of these conductive lines, the temperature at their location can be determined, providing accurate temperature data from the actual measurement site.
2Reliability
If conventional temperature sensors are used, then temperature measurement is possible, but self-heating effects in 3D structures cause temperature increases that cannot be accurately measured due to the sensor's distance from the heat source
Solution Approach 1:
The temperature measurement is performed locally at the specific location where heat is generated in the 3D structure. The electrode is connected to conductive lines that are in direct contact with or very close to the heat-generating elements, ensuring that the temperature measurement reflects the actual local temperature conditions rather than an averaged or distant temperature.
3Ease of operation
If wiring that is relatively distant from the actually-driven portion is used for temperature measurement, then temperature measurement can be performed, but the temperature measurement is imprecise due to the distance from the measurement site
Solution Approach 1:
The temperature measurement function is merged with the existing conductive lines (gate lines, word lines, bit lines) of the semiconductor device. The electrode for temperature measurement is connected directly to these conductive lines, allowing temperature measurement at the actual location where heat is generated, eliminating the need for separate distant temperature sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more accurate temperature measurement and improved circuit performance by reducing temperature measurement errors and predicting reliability in semiconductor devices.
Implementation Method 1
measure resistance and calculate temperature based on the temperature coefficient of resistance (TCR)
Implementation Method 2
using a multipoint probe like a 4-point probe to measure resistance
Implementation Method 3
heat generated when a semiconductor device is driven is not dissipated outside of the semiconductor device
Data Source
AI summary
A semiconductor device includes: a semiconductor substrate; a plurality of conductive lines formed on the semiconductor substrate; and an electrode for temperature measurement. The electrode is connected to the plurality of conductive lines. An electronic device includes a semiconductor device and has a temperature sensing function. The semiconductor device includes: a semiconductor substrate; a plurality of conductive lines formed on the semiconductor substrate; and an electrode for temperature measurement.