Semiconductor Temperature Sensor with Thermal Transfer Simulation
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Solution Overview
Problem
Existing temperature measurement methods for semiconductor components, especially power transistors, fail to accurately and timely detect the peak temperature at the hottest spot due to the distance of temperature sensors from the hot spot and the inherent thermal inertia of the semiconductor body, leading to delayed temperature changes and potential damage from overheating.
Innovation Solution
A temperature measuring arrangement with an integrated temperature sensor and a control device featuring a low-pass filter that simulates the thermal transfer path, allowing for real-time detection of the hot spot temperature by adapting the filter behavior to match the thermal transfer function, enabling precise and immediate temperature monitoring without physically placing the sensor at the hot spot.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is positioned at the hot spot location in the semiconductor body, then the temperature measurement precision is improved, but the semiconductor component function is impaired
Solution Approach 1:
The patent creates a functional copy of the hot spot temperature behavior through a low-pass filter that simulates the thermal transfer path. Instead of physically placing a sensor at the hot spot (which would impair component function), the system copies the temperature signal characteristics through electrical circuitry (filter with matched time constant), achieving accurate temperature measurement without physical intrusion into the semiconductor structure.
2Reliability
If a temperature sensor is placed at a distance from the hot spot, then the semiconductor component function is maintained, but the temperature measurement precision deteriorates
Solution Approach 1:
The patent implements a feedback mechanism where the output of the low-pass filter (which represents the hot spot temperature) is fed back to the second input of the control amplifier. This feedback loop allows the system to continuously adjust and maintain an accurate representation of the hot spot temperature at the filter output, compensating for the distance between the physical sensor and the hot spot location.
3Speed
If the thermal transfer path is simulated with a low-pass filter, then the response speed is improved, but the device complexity increases
Solution Approach 1:
The patent changes the parameter of time constant matching between the thermal transfer path and the electrical low-pass filter. By selecting a filter time constant that corresponds to the thermal time constant of the semiconductor body, the system achieves real-time temperature detection. This parameter matching transforms the inherently slow thermal response into an electrically manageable signal processing task, improving response speed without requiring complex hardware modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for accurate and real-time monitoring of the hot spot temperature, enabling timely intervention to prevent overheating and damage, improving the reliability of semiconductor component operation by directly simulating the thermal transfer path with a low-pass filter.
Implementation Method 1
the semiconductor body has a thermal transfer path between the predefined position and the position of the temperature sensor with a thermal transfer function having a low-pass filter behavior
Implementation Method 2
provision of a low-pass filter for an input signal, which has a transfer function corresponding to the thermal transfer function
Data Source
AI summary
A component arrangement is disclosed herein comprisinga temperature sensor integrated in a semiconductor body, said temperature sensor being designed to generate a first temperature signal dependent on a temperature in the semiconductor body;a control device comprising a control amplifier, which has a first and a second input and an output, and comprising a low-pass filter having an input and an output, the input of the low-pass filter being coupled to the output of the control amplifier, the first input of the control amplifier being coupled to the temperature sensor and the second input of the control amplifier being coupled to the output of the low-pass filter; andan output, which is coupled to the output of the control amplifier and at which a second temperature signal is available.A method for determining the temperature in a semiconductor component is also disclosed herein.