Semiconductor Temperature Control via Dynamic Speed Adjustment
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Solution Overview
Problem
Semiconductor devices generate excessive heat during high-speed operation, leading to performance degradation and reduced data processing reliability if temperature exceeds a desired range.
Innovation Solution
A semiconductor device with a temperature measurement device, such as a thermistor, and a temperature control circuit that adjusts the operation speed of the semiconductor chip based on temperature readings, using a resistor to mitigate self-heating effects and maintain optimal temperature levels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the operation speed of the semiconductor device is increased, then productivity is improved, but temperature increases causing performance degradation
Solution Approach 1:
The patent implements a feedback control mechanism where a temperature sensor continuously monitors the semiconductor device temperature and feeds this information to a control circuit. The control circuit dynamically adjusts the operation speed based on the measured temperature, creating a closed-loop system that maintains optimal temperature while maximizing productivity.
Solution Approach 2:
The patent makes the operation speed dynamic rather than fixed. The control circuit continuously adjusts the operation speed parameter based on real-time temperature conditions, allowing the system to adapt its performance characteristics to maintain thermal stability while optimizing productivity under varying operational conditions.
2Productivity
If the operation speed is maintained at high levels, then productivity is improved, but reliability deteriorates due to excessive heat
Solution Approach 1:
The feedback control circuit monitors temperature and adjusts operation speed to maintain reliability. When temperature exceeds safe thresholds, the system automatically reduces operation speed to prevent thermal damage, ensuring continuous reliable operation without manual intervention.
Solution Approach 2:
The system proactively reduces operation speed before critical temperature thresholds are reached. By anticipating thermal buildup and preemptively adjusting performance parameters, the system prevents thermal stress and performance degradation before they occur, maintaining reliability through advance protective action.
3Temperature
If the operation speed is reduced to control temperature, then temperature is maintained at desired levels, but productivity decreases
Solution Approach 1:
The system dynamically adjusts operation speed based on real-time temperature conditions rather than maintaining a fixed conservative speed. When temperature is within safe ranges, the system operates at high speed for maximum productivity. When temperature approaches thresholds, it smoothly transitions to lower speeds, optimizing the balance between thermal control and productivity throughout operation.
Solution Approach 2:
The control circuit changes operational parameters (operation speed) in response to temperature measurements. By continuously adjusting this parameter based on thermal conditions, the system maintains optimal temperature control while maximizing productivity during favorable thermal conditions.
4Temperature
If a temperature measurement device is added to monitor and control temperature, then temperature control is improved, but device complexity increases
Solution Approach 1:
The semiconductor device performs self-temperature-monitoring and self-regulation through integrated temperature sensors and control circuits. The system autonomously measures its own temperature and adjusts its operation speed without external monitoring or control systems, reducing overall device complexity while maintaining effective thermal management.
Solution Approach 2:
The temperature measurement and control functions are merged with the existing semiconductor device structure. The temperature sensor is integrated within or near the semiconductor chip, and the control circuit utilizes existing device infrastructure, combining multiple functions into a unified system that minimizes additional complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively maintains semiconductor device performance and reliability by dynamically adjusting operation speed in response to temperature fluctuations, preventing overheating and ensuring stable data processing.
Implementation Method 1
The temperature measurement device may include a thermistor in the package substrate, the thermistor including a resistance that varies with temperature.
Implementation Method 2
The semiconductor package may further include a heat spreader configured to dissipate heat generated in the semiconductor chip away from the semiconductor chip.
Data Source
AI summary
An example embodiment relates to a semiconductor device including a semiconductor package in which a semiconductor chip is mounted on the package substrate. The semiconductor package may include a temperature measurement device and a temperature control circuit. The temperature measurement device may measure a temperature of the semiconductor package. The temperature control circuit may change an operation speed of the semiconductor package on the basis of the temperature of the semiconductor package measured by the temperature measurement device.