Semiconductor Package Temperature Sensing for Thermal Runaway Prevention
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Solution Overview
Problem
Conventional semiconductor devices with switching elements are susceptible to noise during temperature detection and cannot effectively prevent thermal runaway due to uneven current distribution among the elements.
Innovation Solution
A semiconductor device design with a greater number of temperature detection elements than semiconductor chips, mounted on the substrate surface, allowing for individual temperature monitoring and reduced noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single thermistor element is used to detect substrate temperature, then the device structure is simple, but it cannot detect temperature differences between individual switching elements and fails to prevent thermal runaway
Solution Approach 1:
The patent divides the temperature detection function into multiple independent temperature detection elements, each assigned to monitor a specific switching element. This segmentation allows individual temperature monitoring of each switching element, enabling detection of temperature differences that would be missed by a single average temperature measurement, thus preventing thermal runaway.
Solution Approach 2:
The patent implements local temperature detection by placing temperature detection elements in close proximity to each switching element they monitor. This local quality approach ensures that each temperature detection element accurately reflects the temperature of its associated switching element, rather than measuring an averaged substrate temperature.
2Measurement precision
If temperature detection is performed within the semiconductor chip, then temperature can be directly measured, but the detection is susceptible to noise caused by switching operations
Solution Approach 1:
The patent extracts the temperature detection function from the semiconductor chip itself and places it in the substrate. By positioning temperature detection elements on the substrate rather than within the switching elements, the system maintains accurate temperature measurement capability while eliminating the switching noise interference that would affect in-chip detection.
Solution Approach 2:
The substrate acts as an intermediary medium between the switching elements and the temperature detection elements. The temperature detection elements measure the substrate temperature near each switching element, indirectly obtaining the switching element temperature without being directly exposed to the electromagnetic noise generated during switching operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise temperature monitoring of each semiconductor chip, preventing thermal runaway by comparing individual chip temperatures and reducing noise susceptibility.
Implementation Method 1
a plurality of temperature detection elements mounted on the substrate obverse surface
Data Source
AI summary
A semiconductor device includes a substrate, a conductive portion, a sealing resin, a plurality of semiconductor chips, and a plurality of temperature detection elements. The substrate has a substrate obverse surface and a substrate reverse surface that face opposite sides in a thickness direction. The conductive portion is formed on the substrate obverse surface. The sealing resin covers at least a part of the substrate. The sealing resin also covers the entire conductive portion. The plurality of semiconductor chips are disposed on the substrate obverse surface. The plurality of temperature detection elements are disposed on the substrate obverse surface. The number of temperature detection elements is equal to or greater than the number of semiconductor chips.