Temporary Fixing Material for Semiconductor Wafer Shear Peeling
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Solution Overview
Problem
Existing temporary fixing materials for semiconductor wafers lack sufficient heat resistance and shear force resistance, leading to adhesion deterioration and incomplete separation during high-temperature processing treatments.
Innovation Solution
A workpiece treating method utilizing a temporary fixing material with a polymer layer containing a structural unit represented by formula (A1), which includes a divalent organic group with aromatic rings, providing both heat resistance and shear force resistance, allowing the workpiece to be held and easily separated from a support through a shear peeling process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat resistant resin such as cycloolefin resin is used to ensure heat resistance, then heat resistance is improved, but shear force resistance (adhesion) during thinning cannot be sufficiently ensured
Solution Approach 1:
The patent uses a composite temporary fixing material comprising a heat resistant resin (cycloolefin resin) and a tackifier resin. This composite structure allows the heat resistant resin to provide thermal stability while the tackifier resin enhances adhesion and shear force resistance, resolving the contradiction between heat resistance and bonding strength.
Solution Approach 2:
The patent optimizes the composition parameters of the temporary fixing material by controlling the ratio of heat resistant resin to tackifier resin, and adjusting the glass transition temperature and viscosity parameters. This allows the material to maintain appropriate adhesion during processing while withstanding high temperatures, resolving the contradiction through parameter optimization.
2Strength
If a tackifier such as rosin is added to complement adhesion, then shear force resistance is improved, but heat resistance deteriorates because the tackifier is low in heat resistance and may be decomposed or altered
Solution Approach 1:
The patent creates a composite system where the tackifier resin provides adhesion and shear force resistance, while the heat resistant cycloolefin resin matrix maintains thermal stability. The synergistic combination allows the tackifier to function at lower temperatures for bonding while the overall composite withstands high processing temperatures without decomposition.
Solution Approach 2:
The patent selects tackifier resins with specific glass transition temperatures and adjusts the composition ratio to ensure the tackifier remains stable during high-temperature processing. By controlling the viscosity and thermal properties parameters, the material maintains both adhesion and heat resistance, resolving the contradiction between bonding strength and thermal stability.
3Reliability
If a temporary fixing material is required to simultaneously have ability to temporarily hold a workpiece in high-temperature environment and ability to shear-peel the workpiece, then both heat resistance and adhesion are required, but existing materials cannot achieve both properties simultaneously
Solution Approach 1:
The patent develops a composite temporary fixing material where the heat resistant cycloolefin resin provides thermal stability for reliable holding in high-temperature environments, while the tackifier resin component ensures adequate adhesion and enables clean shear-peeling. This composite structure resolves the contradiction by distributing functions among different resin components.
Solution Approach 2:
The patent optimizes key parameters including the glass transition temperature (Tg) of the temporary fixing material, viscosity, and composition ratios to achieve a balance between holding ability and peelability. By controlling these parameters, the material maintains reliable adhesion during high-temperature processing while enabling clean separation afterward, resolving the contradiction between reliability and adhesion deterioration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures the workpiece can withstand high-temperature processing and maintain adhesion during thinning or other treatments, enabling effective shear peeling without adhesion loss, thus ensuring reliable separation and minimal contamination of the semiconductor device.
Implementation Method 1
the polymer (A) including a structural unit represented by the following formula (A1)... a temporary fixing material is required to have heat resistance... a polymer (A) including a structural unit represented by the following formula (A1)
Implementation Method 2
a step (3) of applying a shear force to the temporary fixing material to thereby separate the workpiece from the support
Data Source
AI summary
A workpiece treating method includes a step (1) of forming a stack including a support, a temporary fixing material and a workpiece wherein the material includes a layer containing a polymer (A) in a range of not less than 50 mass %, the polymer (A) including a structural unit represented by the formula (A1), and the workpiece is held on the material; a step (2) of processing the workpiece and/or transporting the stack; and a step (3) of applying a shear force to the material to thereby separate the workpiece from the support.R1 is a divalent organic group including at least one aromatic ring, each of two oxygen atoms bonded to R1 in (A1) is bonded to the aromatic ring, and, when R1 includes two or more aromatic rings, each of the two oxygen atoms is bonded to any one of the aromatic rings.