Semiconductor Module Terminal Sealing With Adhesive Flow Passages
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Solution Overview
Problem
In semiconductor modules, the potting material can damage external terminals by adhering to their conductivity due to insufficient adhesive in the gap between the housing and the L-shaped leg, leading to potential electrical issues.
Innovation Solution
A semiconductor module design featuring a housing with recesses that accommodate a plate-shaped leg, where the leg has passages for adhesive to ensure the adhesive fills the gap between the housing and the leg, preventing potting material from reaching the terminal portion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an L-shaped leg is used to bond the housing and terminal holding frame, then the structural connection is achieved, but the adhesive cannot sufficiently enter the gap between the housing and the L-shaped leg, allowing potting material to reach the terminal portion
Solution Approach 1:
The external terminal is divided into functional segments: a terminal portion for electrical connection, a leg portion for bonding, and a recess portion for adhesive accumulation. This segmentation allows each part to perform its specific function effectively, preventing potting material from reaching the terminal portion while maintaining structural integrity.
Solution Approach 2:
The recess acts as an intermediary structure between the housing and the terminal holding frame. It provides a dedicated space for adhesive to accumulate and form a sealing barrier, preventing direct contact between the potting material and the terminal portion, thus protecting electrical conductivity.
2Reliability
If the recess depth is greater than the leg thickness, then adhesive can accumulate sufficiently to seal the gap, but the leg structure becomes more complex
Solution Approach 1:
The external terminal exhibits local quality variations: the terminal portion maintains simple geometry for electrical connection, while the leg portion incorporates a recess with specific depth greater than the leg thickness. This localized structural modification enables adhesive accumulation and effective sealing without complicating the overall terminal design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents the potting material from adhering to the external terminals, ensuring their conductivity remains intact and the semiconductor module functions reliably.
Implementation Method 1
a portion of the leg in a direction of a length of the leg is provided with at least one passage for the adhesive in the recess, the at least one passage being across the leg in a direction of thickness of the leg
Data Source
AI summary
A semiconductor module includes: a semiconductor element; a housing for housing the semiconductor element, the housing including a terminal hole; a terminal in the terminal hole and being electrically connected to the semiconductor element; a holding member bonded by an adhesive to the housing; and a potting material in the housing, in which the terminal includes a plate-shaped leg between the holding member and the housing including a recess for accommodating the leg, the recess has a depth greater than a thickness of the leg, in the recess, a portion of the leg in a direction of length of the leg is provided with a passage for the adhesive, the passage being across the leg in a direction of thickness of the leg, and a width of the passage is greater than a difference between the depth of the recess and the thickness of the leg.