Semiconductor Terminal Fixation via Adhesive Resin
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Solution Overview
Problem
Existing semiconductor devices face challenges in achieving strong wire bonding, high mass productivity, small size, and low production costs due to issues with terminal fixation, adhesion, and thermal expansion coefficient differences, as well as increased production costs from complex shapes and additional processing steps.
Innovation Solution
A semiconductor device design featuring a frame with ring-shaped step portions and an inner wall, where a terminal is fixed using adhesive resin that bonds the circuit board to the frame and inner wall, allowing for strong ultrasonic bonding and efficient production with reduced size and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a terminal is buried in a frame by integral molding, then the terminal is fixed to the frame, but the adhesion between the terminal and the frame is low and the terminal may come off due to thermal expansion coefficient differences
Solution Approach 1:
An adhesive resin is introduced as an intermediary substance between the terminal and the frame. The adhesive resin bonds the terminal to the frame, providing strong adhesion and preventing the terminal from coming off due to thermal expansion coefficient differences. This mediator resolves the contradiction by creating a bonding interface that overcomes the inherent adhesion problems of direct integral molding.
2Reliability
If the fixed portion of the terminal is made wide to improve fixation, then the terminal is more securely fixed, but the size of the power semiconductor module increases
Solution Approach 1:
The adhesive resin is applied locally at the bonding interface between the terminal and the frame, rather than requiring a wide fixed portion. This localized bonding approach provides strong fixation reliability while maintaining a compact module size, as the adhesive resin concentrates the bonding function in a specific region rather than distributing it over a large area.
3Strength
If an anchor plate is used to bond the terminal to the frame, then the terminal is firmly fixed, but the production cost increases due to additional materials and processes
Solution Approach 1:
The invention extracts the essential function of the anchor plate (providing a bonding surface) and implements it directly through the adhesive resin application process. By eliminating the anchor plate as a separate component and using the adhesive resin to create the bonding interface directly on the frame, the solution reduces material costs and simplifies the manufacturing process while maintaining strong bonding strength.
4Strength
If complex shapes and additional processing steps are used to improve terminal fixation, then the fixation strength is improved, but the production cost increases
Solution Approach 1:
The invention changes the bonding mechanism from mechanical (integral molding, anchor plates) to chemical adhesion (adhesive resin). This parameter change in the bonding approach provides strong fixation strength through chemical bonding while simplifying the manufacturing process, as adhesive resin application is a straightforward process that does not require complex shapes or additional processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables strong wire bonding with improved shear strength, increased productivity, and reduced production costs by effectively fixing the terminal to the frame using adhesive resin, addressing issues of adhesion and thermal expansion while simplifying the manufacturing process.
Implementation Method 1
an adhesive resin that bonds the second step portion and the circuit board and contacts the inner wall and the terminal
Implementation Method 2
during wire bonding, ultrasonic vibration is not effectively transmitted to the terminal 53
Data Source
AI summary
A semiconductor device includes a frame including a first step portion provided in a ring shape in an inner circumference of one main surface of the frame, a second step portion provided in a ring shape in an inner circumference of another main surface of the frame, and an inner wall provided between the first step portion and the second step portion; a terminal leading from the first step portion to outside; a circuit board fitted to the second step portion; and an adhesive resin bonding the second step portion and the circuit board, and contacting the inner wall and the terminal.