Semiconductor Terminal Alignment Using Projection and Through Hole
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Solution Overview
Problem
Existing semiconductor devices face challenges with terminal inclination and positional deviation during assembly, leading to deteriorated workability and reduced reliability.
Innovation Solution
A semiconductor device design that includes a semiconductor chip, a first terminal embedded in a case, and a second terminal with a conductive portion and a projection, where the projection is inserted into a through hole of the first terminal, stabilizing the second terminal's connection to the circuit pattern.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the external terminal is inserted into the surrounding resin case and fixed by the terminal locking member, then the terminal can be held in place, but the terminal may become inclined or deviate from the correct position, deteriorating workability
Solution Approach 1:
The projection is formed on the external terminal in advance during the terminal manufacturing process, and the through hole is formed in the insert terminal beforehand. This preliminary preparation of positioning features enables precise alignment during assembly without requiring additional positioning steps, thereby improving both terminal positioning accuracy and assembly workability
Solution Approach 2:
The projection acts as an intermediary positioning element between the external terminal and the insert terminal. By inserting the projection into the through hole, a precise mechanical interface is created that guides the external terminal into the correct position, eliminating inclination and positional deviation while maintaining ease of assembly
2Strength
If the terminal locking member is used to hold the external terminal, then the terminal is secured, but covering the upper end of the case becomes difficult when the terminal is inclined
Solution Approach 1:
The projection and through hole configuration prevents terminal inclination before the terminal locking member is engaged. By establishing precise positioning in advance, the terminal is kept upright and aligned, making it easy to cover with the terminal locking member without the difficulty caused by inclined terminals
3Adaptability or versatility
If multiple terminals are mounted in the case, then the device functionality is enhanced, but terminal inclination and positional deviation increase, reducing manufacturing workability
Solution Approach 1:
Multiple projections are formed on multiple external terminals in advance, and corresponding through holes are formed in multiple insert terminals. This preliminary positioning feature preparation enables each terminal to be independently and precisely positioned during assembly, maintaining high manufacturing precision even when multiple terminals are mounted to enhance device functionality
Data Source
AI summary
A semiconductor device includes a semiconductor chip, a first terminal, a case, and a second terminal. The semiconductor chip includes the first electrode and the second electrode. The first terminal is electrically connected to the first electrode of the semiconductor chip. The case accommodates the semiconductor chip. A part of the first terminal is embedded in the case. The second terminal includes a conductive portion electrically connected to the second electrode of the semiconductor chip and a projection electrically insulated from the conductive portion. The first terminal includes a through hole provided in a portion exposed from the case. The projection is inserted into the through hole.