Semiconductor Terminal Anchor Part Cohesion
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Solution Overview
Problem
Conventional semiconductor apparatuses face issues with low cohesion between the internal terminal portion and the case, leading to unstable wire bonding and reduced reliability due to heat generation and breakage of bonding wires, which complicates size reduction efforts.
Innovation Solution
A semiconductor apparatus with a resin case and an internal terminal portion featuring a concave anchor part that enhances cohesion between the internal terminal and the case, allowing for improved wire bonding performance without reducing the bonding region area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a concave portion is provided on the bonding region to improve cohesion, then cohesion between internal terminal portion and case is improved, but bonding region area is reduced
Solution Approach 1:
The internal terminal portion is divided into two distinct functional regions: a bonding region with a flat top surface for wire bonding, and an anchor part with a concave portion for mechanical anchoring to the case. This segmentation allows each region to optimize its specific function without compromising the other.
Solution Approach 2:
Different surface geometries are applied to different parts of the internal terminal portion: the bonding region has a flat top surface to maximize bonding area and ensure stable wire bonding, while the anchor part has a concave portion to enhance mechanical cohesion with the case through increased surface area contact and interlocking.
2Reliability
If bonding region area is reduced to improve cohesion, then reliability is improved, but number of bondable wires is decreased
Solution Approach 1:
The internal terminal portion is divided into two distinct functional regions: a bonding region with a flat top surface for wire bonding, and an anchor part with a concave portion for mechanical anchoring to the case. This segmentation allows each region to optimize its specific function without compromising the other.
3Area of stationary object
If insert terminal size is increased to compensate for reduced bonding region, then bonding region area is maintained, but apparatus volume increases
Solution Approach 1:
Different surface geometries are applied to different parts of the internal terminal portion: the bonding region has a flat top surface to maximize bonding area and ensure stable wire bonding, while the anchor part has a concave portion to enhance mechanical cohesion with the case through increased surface area contact and interlocking.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The anchor part effectively secures the bonding region area, stabilizes frictional heat generation during wire bonding, and increases the number of bondable wires, enhancing the reliability and reducing the risk of wire breakage while maintaining a compact apparatus size.
Implementation Method 1
a wire bonding apparatus presses a bonding wire against the bonding region, causes ultrasound vibration to transmit and performs wire bonding using frictional heat thereby generated
Implementation Method 2
performs wire bonding using frictional heat thereby generated
Data Source
AI summary
A semiconductor apparatus includes: a case made of resin; an insert terminal including an external terminal portion embedded in the case and having a first terminal exposed from the case, and an internal terminal portion bent in a L shape with respect to a second terminal of the external terminal portion and having a first surface exposed from the case and an anchor part in close contact with the case; and a bonding wire bonded to the first surface of the internal terminal portion.